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Plasticity in Copper Thin Films

Published online by Cambridge University Press:  10 February 2011

V. Weihnacht  and
W. Brückner
V. Weihnacht
Affiliation:
Institute of Solid State and Materials Research Dresden, Helmholtzstrasse 20, D-01069 Dresden/Germany, v.weihnacht@ifw-dresden.de
W. Brückner
Affiliation:
Institute of Solid State and Materials Research Dresden, Helmholtzstrasse 20, D-01069 Dresden/Germany, v.weihnacht@ifw-dresden.de
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Abstract

Plastic deformation in thin Cu films was studied by stress measurements with the wafercurvature technique during thermal cycling and in combination with four-point bending. The results from 0.5 ¼m and 1 ¼m thick Cu films are compared. In thermal cycling experiments, strengthening during cooling and a Bauschinger-like effect during reheating were observed. The stress-strain behavior investigated by four-point bending showed to be asymmetric regarding tension and compression at lower temperatures. These phenomenons are explained by a dislocation arrangement at the film-substrate interface which has formed during a previous thermal cycle.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 87
Copyright
Copyright © Materials Research Society 2000

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References

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