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Open Circuit Repair Using Thermal Exchange Deposition of Copper

Published online by Cambridge University Press:  25 February 2011

R. J. Von Gutfeld  and
D. R. Vigliotti
R. J. Von Gutfeld
Affiliation:
IBM TJ Watson Research Center, Box 218, Yorktown Heights, New York 10598
D. R. Vigliotti
Affiliation:
IBM TJ Watson Research Center, Box 218, Yorktown Heights, New York 10598
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Abstract

We describe a two step method that uses thermally driven exchange plating to repair open copper circuits with local heating produced by ac Joule losses. The first step utilizes a non-acid copper sulfate solution to grow copper dendrites across the open circuit. This electrical “bridge” is then strengthened using additional plate-up in acid copper sulfate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 204: Symposium E – Chemical Perspectives of Microelectronic Materials II , 1990 , 433
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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