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A New Method for Thermal Diffusivity Measurements in Metals Utilizing the Thermo-Electric Effect

Published online by Cambridge University Press:  15 February 2011

Isaac Shai
Affiliation:
The Pearlstone Center for Aeronautical Engineering Studies, Mechanical Eng. Dept., Ben-Gurion University of the Negev, P. O. Box 653, Beer-Sheva 84105, Israel
Uri Laor
Affiliation:
Nuclear Research Center - Negev, P. O. Box 9001, Beer-Sheva 84190, Israel
Ilan Gilad
Affiliation:
Nuclear Research Center - Negev, P. O. Box 9001, Beer-Sheva 84190, Israel
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Abstract

A new method for the measurement of the thermal diffusivity in metals, using transient conditions, is demonstrated. This method is using the principle of superposition of thermal loads. Only time measurements are required, and no accurate temperature and heat flow rate measurements are needed. The method utilizes the Seebeck effect for the measurement of the time dependence of the temperature. A solution of the heat transfer equation for the model pertinent to the described method is derived, and results obtained for several materials are presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. ASTM designation C177–85, Annual Book of ASTM Standards 1986, Vol.14.01, pp. 116, (ASTM, 1916 Race st. Philadelphia, PA 19103)Google Scholar
2. Parker, W. J., Jenkins, R. J., Butler, C. P. and abbott, G. I., J. Appl. Phys. 32, 9 (1961).Google Scholar
3. Carslaw, H. S. and Jaeger, J. C., Conduction of Heat in Solids (Oxford University Press, London, 1959), p. 113.Google Scholar
4. Shai, I., Aharon, J. and Gilad, I., A Quick Measurement of Thermal Diffusivity in Solids, Presented at the 21st Int. Thermal Conductivity Conf., Lexington, Kentucky, Oct. 1989.Google Scholar
5. Shai, I., Laor, U. and Gilad, I., Superposition of Thermal Loads Model for Measuring Thermal Diffusivity in Solids, To be published.Google Scholar
6. Touloukian, Y. S., Powell, R. W., Ho, C. Y., Nicolaou, M. C., Thermophysical Properties of Matter, The TPRC Data Series, Vol.10: Thermal Diffusivity, (IFI/Plenum, New York - Washington, 1973).Google Scholar