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Investigations Of The Chemical-Mechanical Polishing Of Polymer Films For ILD Applications

  • Jan. M. Neirynck (a1), S. P. Murarka (a1) and R. J. Gutmann (a1)

Abstract

Low dielectric constant films are being investigated as the interlayer dielectric (ILD) in a multilevel interconnection scheme for advanced ULSI circuits. In such applications they will be subjected to planarization processes using chemical-mechanical polishing (CMP), either directly during dielectric planarization or indirectly in the final stages of metal patterning using the Damascene process. In this paper we report the results of our initial investigations of the CMP of three different polymers, all with dielectric constant in the range of 2.3 – 2.7 and with different mechanical and chemical properties. The CMP was carried out using alumina as the abrasive in basic and acidic pH slurries. The effect of preannealing the polymer on the CMP behavior was also investigated

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[1] Dabral, S., “Investigation of Multichip Packaging Using Vapor Depositable polymers”, Ph.D. Thesis, Rensselaer Polytechnic Institute, 1992
[2] Zhang, X., “Parylene as an Interlevel Dielectric”, Ph.D. Thesis, Renssealaer Polytechnic Institute, 1995
[3] Burton, E. F., The Physical Properties of Colloidal Solutions, Longmans Green and Co, 1938, pp.186–7
[4] Cuan, G., “Parylene as an Interlevel Dielectric”, Intel internal correspondence, January 10 1992
[5] Dow Chemical Company, “Technical Data Sheets”, Applied Organics and Functional Polymers, Midland MI
[6] Lee, Y. K., Murarka, S. P., Jeng, S. -P., Auman, B., ”Investigations of Low-Dielectric-Constant Fluorinated Polyimide for Use as Interlayer Dielectric in ULSI”, April 1995, presented in this conference

Investigations Of The Chemical-Mechanical Polishing Of Polymer Films For ILD Applications

  • Jan. M. Neirynck (a1), S. P. Murarka (a1) and R. J. Gutmann (a1)

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