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Electron Beam Processing for Spin-on Polymers and its Applications to Back-End-of-Line (BEOL) Integration

Published online by Cambridge University Press:  10 February 2011

J. J. Yang
Affiliation:
AlliedSignal Inc., Advanced Microelectronics Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
J. Gill
Affiliation:
AlliedSignal Inc., Advanced Microelectronics Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
J. Kennedy
Affiliation:
AlliedSignal Inc., Advanced Microelectronics Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
S.-Q. Wang
Affiliation:
AlliedSignal Inc., Advanced Microelectronics Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
L. Forester
Affiliation:
AlliedSignal Inc., Advanced Microelectronics Materials, 1349 Moffett Park Drive, Sunnyvale, CA 94089
M. Ross
Affiliation:
AlliedSignal Inc., Electron Vision, 10119 Carroll Canyon Road, San Diego, CA 92131
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Abstract

The versatility of e-beam processing provides the capability of tailoring the properties of spin-on polymers. Using different e-beam processing schemes, one can obtain a variety of films such as a homogeneous film with modified properties from the original, a film with variable properties as a function of depth, or a film having two distinct layers. In this paper, we demonstrated how to utilize this advantage of e-beam process to facilitate integration of spin-on polymers in the back-end-of-line manufacturing.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

1. Forester, L., et al., Proceedings of the 12th International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara, p. 83 (1995).Google Scholar
2. Kennedy, J., et al., Proceedings of Int. Conf. On Metallurgical Coatings and Thin Films (ICMCTF), San Diego, (1996).Google Scholar
3. Yang, J. J., et al., Proceedings of Advanced Metalization and Interconnect Systems for ULSI Applications in 1996, MRS, p. 50 5 (1997).Google Scholar
4. Yang, J. J., et al., Proceedings of Advanced Metalization and Interconnect Systems for ULSI Applications in 1997, MRS, p.359 (1998).Google Scholar
5. Liversay, W. R., J. Vac. Sci. & Tech., B, 11(6), 2304 (1993).Google Scholar
6. Grun, A. E., Naturforsch, Z., 12a, 8995 (1957).Google Scholar
7. Furumura, Y., Proceedings of Advanced Metalization and Interconnect Systems for ULSI Applications in 1996, MRS, p. 40 1 (1997).Google Scholar
8. Goo, J., et al., Proceedings of the 4b Int. Dielectrics for ULSI Multilevel Interconnection Conference (DUMIC), Santa Clara, p. 295 (1998).Google Scholar