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Effects of Mechanical Properties of Metal Films on The Adhesion Strength of Cr/Polyimide Interfaces

Published online by Cambridge University Press:  15 February 2011

Jin Won Choi  and
Tae Sung Oh
Jin Won Choi
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121–791, Korea
Tae Sung Oh
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121–791, Korea
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Abstract

Effects of mechanical properties of Cu/Cr metal films on the peel strength of Cr/PI interfaces have been studied. Cr and Cu thin films were successively sputter-deposited on in-situ RF plasma-treated polyimides, and 20 μm-thick Cu was electroplated. With increasing the yield strength of Cu/Cr films from 156 MPa to 325 MPa, peel strength of Cr/PMDA-ODA and Cr/BPDA-PDA were lowered from 75 g/mam to 57 g/mm and from 69 g/mm to 20 g/mm, respectively. With identical Cu/Cr metal films, lower peel strength was obtained on Cr/BPDA-PDA interfaces, compared to the values of Cr/PMDA-ODA. Peel strength was also decreased more pronouncedly on Cr/BPDA-PDA with increasing the yield strength of Cu/Cr metal films. With T/H (80°C/94% R.H.) exposure, however, peel strength was lowered much more pronouncedly on Cr/PMDA-ODA than on Cr/BPDA-PDA, especially for specimens with Cu/Cr metal films of lower yield strength.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 121
Copyright
Copyright © Materials Research Society 1997

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