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Densification and Crystallization Kinetics of Cordierite Glass-Ceramic Coatings on Rigid Substrates

Published online by Cambridge University Press:  10 February 2011

Jesus Noel Calata ,
Sihua Wen  and
Guo-Quan Lu
Jesus Noel Calata
Affiliation:
Virginia Polytechnic Inst and State Univ, Dept of Materials Science and Engineering, Blacksburg VA 24061
Sihua Wen
Affiliation:
Virginia Polytechnic Inst and State Univ, Dept of Materials Science and Engineering, Blacksburg VA 24061
Guo-Quan Lu
Affiliation:
Virginia Polytechnic Inst and State Univ, Dept of Materials Science and Engineering, Blacksburg VA 24061
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Abstract

We report our findings on the sintering kinetics of slip-cast glass-ceramic coatings on rigid substrates at temperatures between 900°C and 1000°C; the glass-ceramic crystallizes into cordierite at sintering temperatures above 900°C. Changes in coating thickness during sintering were monitored in situ using an optical setup, and the crystallization of the coatings was determined by x-ray diffraction. The coatings went through a rapid shrinkage due to initial densification, followed by an expansion stage caused by the transformation of the glass into a crystalline phase with a lower density. The rate and extent of the expansion were more noticeable at sintering temperatures above 900°C. We also found that wetting between the glass-ceramic and the substrate was important to the sintering kinetics and sintered microstructure of the coatings. For coatings formed on silicon substrate, growth of large pores was observed at the glass-ceramic/silicon interface. Using wafer-curvature measurement technique, we found a significant tensile stress build-up in the coatings during the initial stage of sintering. We believe that the combination of poor wetting and the tensile stress build-up led to the observed desintering phenomenon at the glass-ceramic/silicon interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 481: Symposium P – Science and Technology of Semiconductor Surface Preparation , 1997 , 483
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1. Tummala, R. R., in Microelectronics Packaging Handbook, edited by Tummala, R. R. and Rymaszewski, E. J., (Van Nostrand Reinhold, New York 1989) Chapter 7.Google Scholar
2. Licari, J. J. and Enlow, L. R., Hybrid Microcircuit Technology Handbook, (Noyes Publications, New Jersey, 1988).Google Scholar
3. Partridge, G., Elyard, C. A. and Budd, M. I., in Glasses and Glass-Ceramics, edited by Lewis, M. H. (Chapman and Hall, London 1989) Chapter 7.Google Scholar
4. Kingery, W. D., Bowen, H. K., and Uhlmann, D. R., Introduction to Ceramics, 2nd ed. (Wiley, New York, 1976) Chapter 10.Google Scholar
5. Lu, G-Q., Sutterlin, R. C., and Gupta, T. K., J. Am. Ceram. Soc., 76 [8] 1907–14 (1993).Google Scholar
6. Rahaman, M. N. and De Jonghe, L. C., J. Am. Ceram. Soc., 69 [1] 53–58 (1986).Google Scholar
7. Bordia, R. K. and Raj, R., J. Am. Ceram. Soc., 68 [6] 287–92 (1985).Google Scholar
8. Hsueh, C. H., Scr. Metall., 19, 1213–17 (1985).Google Scholar
9. Scherer, G. W. and Garino, T., J. Am. Ceram. Soc., 68 [4] 216–220 (1985).Google Scholar
10. Bang, J. and Lu, G-Q., J. Mater. Res., 10 [5] (1995).Google Scholar
11. Choe, J., Calata, J. N., and Lu, G-Q., J. Mater. Res. 10 [4] (1995).Google Scholar
12. Beall, G. H. and Duke, D. A., in Glass Forming Systems, Vol. 1, edited by Uhlmann, D. R. and Kreidl, N. J. (Academic, New York 1983).Google Scholar
13. Knickerbocker, S. H., Kumar, A. H. and Herron, L. W., Am. Ceram. Soc. Bull., 72, (1), 90–95 (1993).Google Scholar
14. Tummala, R. R., J. Am. Ceram. Soc., 74 [5] 895–908 (1991).Google Scholar
15. Onoda, G. Y. and Hench, L. L. (eds.), Ceramic Processing Before Firing, (Wiley, New York, 1978).Google Scholar
16. Reed, J. S., Principles of Ceramic Processing, (Wiley, New York, 1978).Google Scholar
17. Ohring, M., The Materials Science of Thin Films (Academic Press, San Diego, CA, 1992), pp. 403–450.Google Scholar
18. Bordia, R. K. and Jagota, A., J. Am. Ceram. Soc., 76 [10] 2475–85 (1993).Google Scholar
19. Scherer, G. W., J. Non-Cryst. Solids, 34, 239–56 (1979).Google Scholar
20. Bang, J. and Lu, G-Q., J. Am. Ceram. Soc., 78 [3] 813–15 (1995).Google Scholar