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Adhesion of Cyclotene™ (BCB) Coatings on Silicon Substrates

Published online by Cambridge University Press:  15 February 2011

P. H. Townsend ,
D. Schmidt ,
T. M. Stokich ,
S. Kisting ,
D. C. Burdeaux ,
D. Frye ,
M. Bernius ,
M. Lanka  and
K. Berry
P. H. Townsend
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
D. Schmidt
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
T. M. Stokich
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
S. Kisting
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
D. C. Burdeaux
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
D. Frye
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
M. Bernius
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
M. Lanka
Affiliation:
PolyCon Corp., 2495 So. Industrial Park Ave., Tempe, AZ 85282
K. Berry
Affiliation:
PolyCon Corp., 2495 So. Industrial Park Ave., Tempe, AZ 85282
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Abstract

This work examines the adhesion of coatings derived from divinylsiloxane bisbenzocyclobutene, mixed stereo and positional isomers of 1,3-bis(2-bicyclo[4.2.0]octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane (CAS 117732–87–3), on oxidized silicon substrates treated with silane coupling agents.This material, commercially available as Cyclotene™ 3022, can be used in the construction of high performance electronic circuits, such as multichip modules. Silane coupling agents examined in this study were 3-aminopropyltriethoxysilane (CAS 01760-24-3)(APTES)(, vinyltriethoxysilane (CAS 00078–08–0)(VTES), and 3-methacryloxypropyl trimethoxysilane (CAS 02530–85–0) (MOP-TMS).

Measurement of the interfacial adhesion was performed using microindentation. Bond strengths obtained by this method exceed 200 MPa for the most effective coupling agents. However, these high bond strengths were not found to correlate with acceptable adhesive performance in all cases. In addition to the choice and preparation of the coupling agent, process related chemical exposure has been found to be a key element in the observed adhesive performance. The effect of the cure schedule for the thermoset coating has also been found to be a controlling factor. A short cycle test vehicle was developed consisting of a single 20 gIm polymer layer etched with anisotropic sidewalls. This test vehicle was used to evaluate the efficacy of the coupling agents during process exposures and subsequent thermal shock testing. A solution of MOP-TMS pre-hydrolyzed in methanol was found to produce the most reliable interface with high bond strength.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 365
Copyright
Copyright © Materials Research Society 1994

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References

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