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Wet-Chemical Processing of Tin-Doped Indium Oxide Layers

Published online by Cambridge University Press:  21 February 2011

Mark J. Van Bommel
Affiliation:
Philips Research Laboratories, Prof. HolstJaan 4, 5656 AA Eindhoven, The Netherlands.
Tom N.M. Bernards
Affiliation:
Philips Research Laboratories, Prof. HolstJaan 4, 5656 AA Eindhoven, The Netherlands.
Wim Talen
Affiliation:
Philips Research Laboratories, Prof. HolstJaan 4, 5656 AA Eindhoven, The Netherlands.
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Abstract

For industrial applications the wet-chemical deposition of tin-doped indium oxide (ITO) layers would be favourable, especially at low temperatures.

It is shown that conductive transparent films can be made by spinning solutions which contain alkoxide precursors of indium and tin. The hydrolysis conditions of these alkoxides are varied using different water to indiumalkoxide ratios and different hydrolysis times. It is shown that when processed at low temperatures, the hydrolysis of these alkoxides has a severe influence on the electrical properties of the layers. A decrease in resistance as a function of time is observed for ITO layers which are stored at room temperature in an ambient atmosphere. Annealing at 350°C in forming gas further reduces the resistance of the ITO layers.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1 Arisen, N.J., Kaufman, R. and Dislich, H., Ultrastructure Processing of Advanced Materials edited by Mackenzie, J. and Ulrich, D.F.R., (Wiley, New York, 1984) p. 189.Google Scholar
2 Arisen, N.J., Kaufman, R. and Dislich, H., German Patent DE 3,300,589 (12 July 1984).Google Scholar
3 Gallagher, D. and Ring, T. A., Ceramic Transactions 22, 719 (1991).Google Scholar
4 Mattox, D.M., Thin Solid Films 204, 25 (1991).Google Scholar
5 Takahashi, Y., Hayashi, H. and Ohya, Y., Better Ceramics through Chemsitry V, edited by Hampden-Smith, M.J., Klempenere, W.G. and Blinker, C.J., (Mat Res. Soc. Proc. 271, Pittsburgh, PA, 1992) p. 401.Google Scholar
6 Gallagher, D., Scalan, F., Houriet, R., Mathieu, H.J. and Ring, T.A., J. Mat. Res. 8, 3135 (1993).Google Scholar
7 Maruyama, T. and Kojima, A., Jap. J of Appl. Phys. 27, L1829 (1988).Google Scholar
8 Franck, G. and Köstlin, H., Appl. Phys. A27, 197 (1982).Google Scholar
9 Köstlin, H., Festkorperprobleme edited by Treusch, J., (Advances in Solid State. Physiscs XXII, Vieweg, Braunsweig, 1982) p. 229.Google Scholar
10 van der Pauw, L.J., Philips Res. Rep. 13 (1958) 1.Google Scholar