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Thin Film Transistors on Plastic Substrates Using Silicon Deposited by Microwave ECR-CVD

Published online by Cambridge University Press:  15 February 2011

Lihong Teng
Affiliation:
Department of Electrical Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260.
Wayne A. Anderson
Affiliation:
Department of Electrical Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260.
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Abstract

The properties of thin film transistors (TFT's) on plastic substrates with active silicon films deposited by microwave ECR-CVD were studied. Two types of plastic were used, PEEK and polyimide. The a-Si:H TFT deposited at 200°C on polyimide substrates showed a saturation field effect mobility of 4.5 cm2/V-s, a threshold voltage of 3.7 V, a subthreshold swing of 0.69 V/dec and an ON/OFF current ratio of 7.9×106, while the TFT fabricated on PEEK at 200°C showed a saturation field effect mobility of 3.9 cm2/V-s, a threshold voltage of 4.1 V, a subthreshold swing of 0.73 V/dec and an ON/OFF current ratio of 4×106. Comparison is made to TFT's with the Si deposited at 400°C on glass.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

[1] Smith, P.M., Carey, P.G. and Sigmon, T.W., Appl. Phys. Lett., vol. 70, pp.342344, 1997.Google Scholar
[2] Sazonov, A. and Nathan, A., J. Vac. Sci. Technol., vol. A18, pp. 780782, 2000.Google Scholar
[3] Wehrspohn, R. B., Deane, S.C., French, I. D., Gale, I., Hewett, J., Powell, M. J. and Robertson, J., J. Appl. Phys., vol. 87, pp. 144154, 2000.Google Scholar
[4] Choi, W. C., Kim, E. K., Min, S. K., Park, C. Y., Kim, J. H. and Seong, T. Y., Appl. Phys. Lett., vol. 70, pp. 30143016, 1997.Google Scholar
[5] Kitagawa, M., Setsune, K., Manabe, Y. and Hirao, T., Jpn. J. Appl. Phys., vol. 27, pp. 20262031, 1988.Google Scholar
[6] Roth, J. R., “Industrial plasma engineering,” vol. 1, pp. 501510, 1995, Institute of Physics Publishing.Google Scholar
[7] Jagannathan, B. B., Wallace, R. L. and Anderson, W. A., J.Vac. Sci. Technol., vol. A16, pp. 27512756, 1998.Google Scholar
[8] Chen, C-Y and Kanicki, J., IEEE Electron Device Lett., vol. 17, pp. 437439, 1996.Google Scholar
[9] Madan, A., Comber, P. G. Le and Spear, W. E., J. Non-Crystalline Solids, vol. 20, pp. 239257, 1976.Google Scholar
[10] Walle, C. G. Van de and Tuttle, B. R., IEEE Trans. Electron Devices, vol. 47, pp. 17791786, 2000.Google Scholar