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In Situ Stress and Strain Measurements During the Growth of Cu/Ni (001) Multilayers

Published online by Cambridge University Press:  14 March 2011

T. Bigault
Affiliation:
TECSEN, CNRS, Univ Aix-Marseille III, 13397 Marseille Cedex 20, France
F. Bocquet
Affiliation:
TECSEN, CNRS, Univ Aix-Marseille III, 13397 Marseille Cedex 20, France
S. Labat
Affiliation:
TECSEN, CNRS, Univ Aix-Marseille III, 13397 Marseille Cedex 20, France
O. Thomas
Affiliation:
TECSEN, CNRS, Univ Aix-Marseille III, 13397 Marseille Cedex 20, France
A. Marty
Affiliation:
DRFMC/SP2M/NM, CEA Grenoble Cedex 9, 38054, France
B. Gilles
Affiliation:
LTPCM-ENSEEG, BP 75, 38402 St Martin d'Hères, France
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Abstract

Cu/Ni (001) multilayers have been grown by molecular beam epitaxy at room temperature. In-situ electron diffraction and curvature measurements performed during the growth are presented. The average lattice parameter in the equiatomic multilayers evolves gradually towards the alloy lattice parameter. The in-plane lattice parameter of both Cu and Ni evolves continuously towards the bulk lattice parameter with no evidence of pseudomorphic growth. The combination of diffraction and curvature measurements suggests that the Ni on Cu interface is diffuse. This is attributed to the surfactant behaviour of Cu. This results shed new insights into the interesting magnetic properties of Ni films on Cu (001).

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

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