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A Calorimetric Evaluation Of The Peel Adhesion Test

Published online by Cambridge University Press:  15 February 2011

J. L. Goldfarb ,
R. J. Farris ,
Z. Chai  and
F. E. Karasz
J. L. Goldfarb
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
R. J. Farris
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
Z. Chai
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
F. E. Karasz
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
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Abstract

Simultaneous mechanical and calorimetric measurements of the work and the heat of peeling have been made for polyester films bonded to rigid metal substrates with a pressure sensitive adhesive. Most of the work expended in peeling is consumed by plastic deformation and viscous dissipation. 70% to 85% of the peel energy is dissipated as heat. The peeled polyester films were tightly curled. Energy stored in the peeled polyester films was measured using solution calorimetry and a significant fraction of the peel energy not dissipated as heat was found to be stored in the peeled films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 335
Copyright
Copyright © Materials Research Society 1991

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References

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