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A study on the effect of reducing agent content on the thickness of electroless Ni3P deposits on B4C nanoparticles

Published online by Cambridge University Press:  20 February 2013

M. Hajizamani ,
A. Alizadeh ,
N. Ehsani  and
M. Mirjani
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Abstract

Deposition of Ni3P nano-scale layer on B4C nanoparticles in four contents of sodium hypophosphite as reducing agent including 5, 10, 15 and 30 g/l via electroless coating were done to investigate the effect of reducing agent content on the coating thickness of deposited Ni3P. The bath pH and temperature was 5.5 and 85 °C, respectively and the coating time was 25 min. The powders were characterized by transmission electron microscopy (TEM) and the phases present were revealed by X-ray diffraction (XRD). Nickel and phosphorous contents of the coatings were measured by inductively coupled plasma analysis (ICP). The results revealed that by increasing the reducing agent content from 5 g/l to 30 g/l the average coating thickness increased from 19 nm to 28 nm. Although the increasing effect of adding sodium hypophosphite content was preserved, there is a critical amount for sodium hypophosphite content to increase the coating thickness.

Keywords

Electroless coatingB4C nanoparticleNi3P nano-scale layerreducing agentTEM
Type
Research Article
Information
Metallurgical Research & Technology , Volume 110 , Issue 2 , 2013 , pp. 147 - 152
Copyright
© EDP Sciences 2013

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References

Ferguson, J.D., Buechler, K.J., Weimer, A.W., George, S.M., Powder Technol. 156 (2005) 154-163
Hakim, L.F., George, S.M., Weimer, A.W., Nanotechnology 16 (2005) 375-385
Ferguson, J.D., Weimer, A.W., George, S.M., Thin Solid Films 371 (2000) 95-104
Liu, S.Q., Tao, W.H., Li, J., Yang, Z.X., Liu, F.T., Powder Technol. 155 (2005) 187-192
Yang, C.C., Chen, S.Y., Cheng, S.Y., Powder Technol. 148 (2004) 3-6
Jiang, Z.J., Liu, C.Y., J. Phys. Chem. B107 (2003) 12411-12415
Afzali, A., Mottaghitalab, V., Motlagh, M. Saberi, Khodaparast Haghi, A., Korean J. Chem. Eng. 27 (2010) 1145-1149
Ang, L.M., Hor, T.S.A., Xu, G.O., Tung, C.H., Zhao, S.P., Wang, J.L.S, Decoration of activated carbon nanotubes with copper and nickel Carbon 38 (2000) 363-372 Google Scholar
Chen, Y.J., Cao, M.S., Tian, Q., Wang, T.H., Zhu, J., Mater. Lett. 58 (2004) 1481-1484
Kobayashi, T., Ishibashi, J., Mononobe, S., Ohtsu, M., Honma, H., J. Electrochem. Soc. 147 (2000) 1046-1049
Chung, W.S., Chang, S.Y., Lin, S.J., Plat. Surf. Finish. 83 (1996) 68-81
Chen, Y.J., Cao, M.S., Xu, Q., Zhu, J., Surf. Coating Technol. 172 (2003) 90-94
Motizuki, I., Izawa, K., Watanabe, J., Honma, H., T. I. Met. Finish. 77 (1999) 41-43
Hagiwara, K., Watanabe, J., Honma, H., Plat. Surf. Finish. 84 (1997) 74-76
Lee, K.B., Sim, H.S., Cho, S.Y., Kwon, H., Metall. Mater. Trans. A 32A (2001) 2142-2147
Kerti, I., Toptan, F., Mater. Lett. 62 (2008) 1215-1218
G.O. Mallory, J.B. Hajdu, Electroless Plating: Fundamentals and Applications. American Electroplaters and Surface Finishing Society, Florida, 1990
Zhang, Z., Chen, X.G., Charette, A., Compos. J. Mater. Sci. 44 (2009) 492-501
Alizadeh, A., Taheri-nassaj, E., Hajizamani, M., Nanoparticles J. Mater. Sci. Technol. 27 (2011) 1113-1119
Hashim, J., Looney, L., Hashmi, MSJ, J. Mater. Proc. Technol. 119 (2001) 324-328
Tekmen, C., Cocen, U., Journal of Turkish Ceramic Federation 17 (2006) 118-125
Tekmen, C., Ervardar, O., Cocen, U., J. Compos. Mater. 41 (2007) 3027-3033
Krishnan, K.H., John, S., Srinivasan, K.N., Praveen, J., Ganesan, M., Kavimani, P.M., Metall. Mater. Trans. A37 (2006) 1917-1926
Ebrahimian-Hosseinabadi, M., Azari-Dorcheh, K., Moonir Vaghefi, S.M., Wear 260 (2006) 123-127
Vafaei-Makhsoos, E., Thomas, E.L., Toth, L.E., Metall. Trans. 9 (1978) 1449-1460