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A new method to study cyclic deformation of thin films in tension and compression

Published online by Cambridge University Press:  31 January 2011

M. Hommel ,
O. Kraft  and
E. Arzt
M. Hommel
Affiliation:
Max-Planck-Institut für Metallforschung, Seestrasse 92, D-70174 Stuttgart, Germany
O. Kraft
Affiliation:
Max-Planck-Institut für Metallforschung, Seestrasse 92, D-70174 Stuttgart, Germany
E. Arzt
Affiliation:
Max-Planck-Institut für Metallforschung, Seestrasse 92, D-70174 Stuttgart, Germany
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Abstract

In this paper, a new method to study cyclic plastic deformation in thin metal films is presented. Cu films were deposited onto compliant substrates allowing the film to be subjected to tensile and compressive stresses on loading and unloading of the film/substrate composite. The film stress was measured in situ by x-ray diffraction. First results lend to characteristic stress-strain hysteresis curves, indicative of fatigue processes in small dimensions.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 6 , June 1999 , pp. 2373 - 2376
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Ruud, J. A., Josell, D., Spaepen, F., and Greer, A. L., J. Mater. Res. 8, 112 (1993).CrossRefGoogle Scholar
2.Schadler, L.S. and Noyan, I.C., Appl. Phys. Lett. 66, 22 (1995).CrossRefGoogle Scholar
3.Baker, S.P. and Nix, W. D., J. Mater. Res. 9, 3145 (1994).CrossRefGoogle Scholar
4.Weihs, T.P., Hong, S., Bravman, J.C., and Nix, W.D., J. Mater. Res. 3, 931 (1988).CrossRefGoogle Scholar
5.Flinn, P.A., Gardner, D. S., and Nix, W.D., IEEE Trans. Electron Devices ED–34, 689 (1987).CrossRefGoogle Scholar
6.Venkatraman, R. and Bravman, J.C., J. Mater. Res. 7, 2040 (1992).CrossRefGoogle Scholar
7.Bader, S., Flinn, P. A., Arzt, E., and Nix, W. D., J. Mater. Res. 9, 318 (1994).CrossRefGoogle Scholar
8.Keller, R-M., Baker, S.P., and Arzt, E., J. Mater. Res. 13, 1307 (1998).CrossRefGoogle Scholar
9.Kretschmann, A., Kuschke, W-M., Baker, S. P., and Arzt, E., in Thin Films: Stresses and Mechanical Properties VI, edited by Gerberich, W.W., Gao, H., Sundgren, J-E., and Baker, S. P. (Mater. Res. Soc. Symp. Proc. 436, Pittsburgh, PA, 1997), pp. 59–64.Google Scholar
10.Kuschke, W-M., Kretschmann, A., Keller, R-M., Vinci, R. P., Kauffmann, C., and Arzt, E., J. Mater. Res. (1999, in press).Google Scholar
11.Noyan, I. C. and Cohen, J.B., Residual Stress: Measurements by Diffraction and Interpretation (Springer-Verlag, New York, 1987).CrossRefGoogle Scholar
12.Besser, P.R., Brennan, S., and Bravman, J. C., J. Mater. Res. 9, 13 (1994).CrossRefGoogle Scholar
13.Landolt–Börnstein, , Numerical Data and Functional Relationship in Science and Technology–Group III, edited by Hellwege, K-H. (Springer-Verlag, New York, 1979), p. 6.Google Scholar
14.Hommel, M., unpublished results (1998).Google Scholar