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A review of electroplating for V–VI thermoelectric films: from synthesis to device integration

Published online by Cambridge University Press:  11 September 2015

Raimar Rostek ,
Nicolas Stein  and
Clotilde Boulanger
Raimar Rostek
Affiliation:
Institute of Microsystems Engineering – IMTEK, University of Freiburg, Georges-Köhler-Allee 102, 79110 Freiburg, Germany
Nicolas Stein
Affiliation:
Institut Jean Lamour, Université de Lorraine, CNRS, 1 Bd Arago, 57078 Metz cedex 1, France
Clotilde Boulanger*
Affiliation:
Institut Jean Lamour, Université de Lorraine, CNRS, 1 Bd Arago, 57078 Metz cedex 1, France
*
a)Address all correspondence to this author. e-mail: clotilde.boulanger@univ-lorraine.fr
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Abstract

Starting with the first published works on the electrochemical deposition of thermoelectric (TE) V–VI compounds in the early nineties, these past two decades have seen a steady increase in scientific interest and publications on this topic. This is hardly surprising, as TE devices offer unique opportunities for power generation in virtually any environment (“energy harvesting”) or demanding cooling applications through the Peltier effect. This review first provides an overview of the advances in the electrodeposition of n- and p-type thin films based on Bi2(Te, Se)3 and (Bi, Sb)2Te3, the currently best-known TE materials for room temperature applications. The overview includes information about the electrolyte and the deposition conditions as well as the achieved composition, thickness, morphology, and TE properties of the deposited films. Additionally, we present the state-of-the-art and recent developments in electroplating-based fabrication processes for microscale TE devices.

Keywords

electrodepositionthermoelectricitymicroscale devices
Type
Invited Review
Information
Journal of Materials Research , Volume 30 , Issue 17: Focus Issue: Advances in Thermoelectric Materials II , 14 September 2015 , pp. 2518 - 2543
Copyright
Copyright © Materials Research Society 2015 

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References

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