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Energy efficiency enhancements for semiconductors, communications, sensors and software achieved in cool silicon cluster project*

Published online by Cambridge University Press:  05 July 2013

Frank Ellinger ,
Thomas Mikolajick ,
Gerhard Fettweis ,
Dieter Hentschel ,
Sabine Kolodinski ,
Helmut Warnecke ,
Thomas Reppe ,
Christoph Tzschoppe ,
Jan Dohl  and
Corrado Carta
...Show all authors
Frank Ellinger*
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Thomas Mikolajick
Affiliation:
NaMLab, Nöthnitzer Straße 64, 01187 Dresden, Germany
Gerhard Fettweis
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Dieter Hentschel
Affiliation:
Fraunhofer, Technologie-Campus 3, 09126 Chemnitz, Germany; Maria-Reiche-Straße 2, 01109 Dresden
Sabine Kolodinski
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Helmut Warnecke
Affiliation:
Infineon, Königsbrücker Straße 180, 01099 Dresden, Germany
Thomas Reppe
Affiliation:
Silicon Saxony, Manfred-von-Ardenne-Ring 20, 01099 Dresden, Germany
Christoph Tzschoppe
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Jan Dohl
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Corrado Carta
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
David Fritsche
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Gregor Tretter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Maciej Wiatr
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Stefan Detlef Kronholz
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Ricardo Pablo Mikalo
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Harald Heinrich
Affiliation:
Infineon, Königsbrücker Straße 180, 01099 Dresden, Germany
Robert Paulo
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Robert Wolf
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Johannes Hübner
Affiliation:
Radioopt, Altmarkt 10, 01067 Dresden, Germany
Johannes Waltsgott
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Klaus Meißner
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Robert Richter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Oliver Michler
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Markus Bausinger
Affiliation:
Plastic Logic, An der Bartlake 5, 01109 Dresden, Germany
Heiko Mehlich
Affiliation:
Roth&Rau, An der Baumschule 6-8, 09337 Hohenstein-Ernstthal, Germany
Martin Hahmann
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Henning Möller
Affiliation:
nxp, Am Waldschlösschen 1, 01099 Dresden, Germany
Maik Wiemer
Affiliation:
Fraunhofer, Technologie-Campus 3, 09126 Chemnitz, Germany; Maria-Reiche-Straße 2, 01109 Dresden
Hans-Jürgen Holland
Affiliation:
Fraunhofer, Technologie-Campus 3, 09126 Chemnitz, Germany; Maria-Reiche-Straße 2, 01109 Dresden
Roberto Gärtner
Affiliation:
xfab, Grenzstrasse 28, 01109 Dresden, Germany
Stefan Schubert
Affiliation:
Productivity Engineering, Sachsenallee 9, 01723 Kesselsdorf, Germany
Alexander Richter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Axel Strobel
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Albrecht Fehske
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Sebastian Cech
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Uwe Aßmann
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Andreas Pawlak
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Michael Schröter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Wolfgang Finger
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Stefan Schumann
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Sebastian Höppner
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Dennis Walter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Holger Eisenreich
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
René Schüffny
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
*
ae-mail: Frank.Ellinger@tu-dresden.de
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Abstract

An overview about the German cluster project Cool Silicon aiming at increasing the energy efficiency for semiconductors, communications, sensors and software is presented. Examples for achievements are: 1000 times reduced gate leakage in transistors using high-fc (HKMG) materials compared to conventional poly-gate (SiON) devices at the same technology node; 700 V transistors integrated in standard 0.35 μm CMOS; solar cell efficiencies above 19% at < 200 W/m2 irradiation; 0.99 power factor, 87% efficiency and 0.088 distortion factor for dc supplies; 1 ns synchronization resolution via Ethernet; database accelerators allowing 85% energy savings for servers; adaptive software yielding energy reduction of 73% for e-Commerce applications; processors and corresponding data links with 40% and 70% energy savings, respectively, by adaption of clock frequency and supply voltage in less than 20 ns; clock generator chip with tunable frequency from 83-666 MHz and 0.62-1.6 mW dc power; 90 Gb/s on-chip link over 6 mm and efficiency of 174 fJ/mm; dynamic biasing system doubling efficiency in power amplifiers; 60 GHz BiCMOS frontends with dc power to bandwidth ratio of 0.17 mW/MHz; driver assistance systems reducing energy consumption by 10% in cars

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 63 , Issue 1: International Semiconductor Conference Dresden-Grenoble – ISCDG 2012 , July 2013 , 14402
Copyright
© EDP Sciences, 2013

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Footnotes

*

Contribution to the Topical Issue “International Semiconductor Conference Dresden-Grenoble – ISCDG 2012”, Edited by Gérard Ghibaudo, Francis Balestra and Simon Deleonibus.

References

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