Hostname: page-component-78c5997874-dh8gc Total loading time: 0 Render date: 2024-11-17T18:00:20.189Z Has data issue: false hasContentIssue false
  • English
  • Français

Internal Stress Development In Spin Coated Polyimide Films

Published online by Cambridge University Press:  15 February 2011

Michael T. Pottiger  and
John Coburn
Michael T. Pottiger
Affiliation:
Du Pont Electronics, P. O. Box 80336, Wilmington, DE 19880–0336
John Coburn
Affiliation:
Du Pont Electronics, P. O. Box 80336, Wilmington, DE 19880–0336
Get access

Abstract

The effect of processing on the development of internal stresses in spin coated polyimide films was investigated. The internal stresses are a result of the coefficient of thermal expansion (CTE) mismatch between the polymer and the substrate. Birefringence and CTE were used to characterize the in-plane molecular orientation. In-plane orientation was shown to be sensitive to processing conditions. Increasing the spin speed results in higher in-plane orientation as observed by an increase in birefringence and a corresponding decrease in CTE. Heating rate during cure was observed to have a significant effect on in-plane orientation. Faster heating rates during cure resulted in a lower birefringence. The lower birefringence is attributed to relaxation effects that can occur during a rapid cure. The decrease in orientation was accompanied by an increase in internal stress.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 187
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Russell, T. P., Gugger, H., and Swalen, J. D., J. Poly. Sci.: Poly. Phys., 21, 1745 (1983).Google Scholar
2. Geldermans, P., Goldsmith, C., and Bedetti, F., “Measurement of Stresses Generated During Curing and in Cured Polyimide Films”, in Polyimides: Synthesis, Characterization and Applications, Vol.2, pp. 695–711, Mittal, K. L., ed. Plenum Press, New York (1984).Google Scholar
3. Elsner, G., J. Appl. Poly. Sci., 34, 815 (1987).CrossRefGoogle Scholar
4. Han, B., Gryte, C., Tong, H., and Feger, C., Proc. of the ANTEC '88 Meeting, November, 1988.Google Scholar
5. Bauer, C. L. and Farris, R. J., Poly. Eng. and Sci., 28(10), 688 (1988).CrossRefGoogle Scholar
6. Inoue, Y. and Kobatake, Y., Kolloid-Zeitschrift, 159(1), 18 (1959).CrossRefGoogle Scholar
7. Dine-Hart, R. A. and Wright, W. W., J. Appl. Poly. Sci., 11, 609 (1967).CrossRefGoogle Scholar
8. Gardner, K. H., Edman, J. R., Freida, J. E., Freilich, S. C., and Manring, L. E., Proc. of the Interdisciplinary Symposium on Recent Advances in Polyimides and Other High Performance Polymers sponsored by the American Chemical Society, San Diego, CA, January 22–25, 1990.Google Scholar