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In-Line Temperature Monitoring of Rapid Thermal Annealing Processes

Published online by Cambridge University Press:  15 February 2011

Minseok Oh ,
Binh Nguyenphu  and
Anthony T. Fiory
Minseok Oh
Affiliation:
AT&T Bell Laboratories, 600 Mountain Ave., Murray Hill, NJ 07974
Binh Nguyenphu
Affiliation:
AT&T Microelectronics, 9333 S. John Young Parkway, Orlando, FL 32819
Anthony T. Fiory
Affiliation:
AT&T Bell Laboratories, 600 Mountain Ave., Murray Hill, NJ 07974
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Abstract

Process control for rapid thermal annealing (RTA) steps in silicon integrated circuit manufacturing is highly dependent on the repeatability of wafer annealing temperatures. The heating lamps in RTA ovens are controlled by an infrared pyrometer in a feedback-control loop. Methods currently in production allow some variability in annealing temperature, owing to the variability of wafer backside emissivities and the fixed emissivity value used for each process recipe. To provide an independent in-situ temperature sensor with potentially improved accuracy, an RTA oven equipped with a ripple pyrometer was used for passive data collection. Results obtained over extensive wafer processing indicate that the ripple temperatures have a correlation with electrical tester data and that the ripple pyrometer repeatability is better than 3°C at 1 standard deviation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 387: Symposium P – Rapid Thermal and Integrated Processing IV , 1995 , 131
Copyright
Copyright © Materials Research Society 1995

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