Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-26T15:01:56.305Z Has data issue: false hasContentIssue false

Growth of Tetrahedral Phases of Boron Nitride thin Films by Reactive Sputtering

Published online by Cambridge University Press:  25 February 2011

T.D. Moustakas
Affiliation:
Molecular Beam Epitaxy Laboratory, Department of Electrical, Computer, and Systems Engineering, Boston University, Boston, Massachusetts, 02215, USA.
T. Lei
Affiliation:
Molecular Beam Epitaxy Laboratory, Department of Electrical, Computer, and Systems Engineering, Boston University, Boston, Massachusetts, 02215, USA.
R. J. Molnar
Affiliation:
Molecular Beam Epitaxy Laboratory, Department of Electrical, Computer, and Systems Engineering, Boston University, Boston, Massachusetts, 02215, USA.
C. Fountzoulas
Affiliation:
Molecular Beam Epitaxy Laboratory, Department of Electrical, Computer, and Systems Engineering, Boston University, Boston, Massachusetts, 02215, USA.
E.J. Oles
Affiliation:
Kennametal Inc., USA.
Get access

Abstract

Tetrahedrally coordinated phases of boron nitride (c-BN and w-BN) were produced by reactive sputtering. The structure of the films was investigated by XRD and TEM diffraction, and found to be poly cry stalline. Films with microhardness up to 3500kg/mm2 were deposited but some degradation over time has been observed. A model for the stabilization of the tetrahedral phases over the graphitic one is proposed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Murarka, S. P., Chang, C. C., Wang, D. N. K., and Smith, T. E., J. Electrochem. Soc. 126, 1951 (1979).CrossRefGoogle Scholar
2. Yuzuriha, T. H. and Hess, D. W., Thin Solid Films, 140, 199 (1986).CrossRefGoogle Scholar
3. Shanfield, S. and Wolfson, R., J. Vac. Sci. Technol, A 1, 323 (1983).CrossRefGoogle Scholar
4. Lee, E. H. and Pooppa, H., J. Vac. Sci. Technol, 14, 223 (1977).CrossRefGoogle Scholar
5. Wiggins, M. D., Aita, C. R. and Hickernell, F. S., J. Vac. Sci. Technol, A 2, 322 (1984).CrossRefGoogle Scholar
6. Mieno, M. and Yoshida, T., Jpn. J. Appl. Phys. Vol 29, L1179 (1990).CrossRefGoogle Scholar
7. Vossen, J. L. and Cuomo, J. J. In “Thin Film Process” (Vossen, J.L. and Kern, W. eds) Chapter 2, Academic Press, N.Y. (1978).Google Scholar
8. JCPDF 25–1033Google Scholar
9. JCPDF 26–773Google Scholar
10. JCPDF 18–251Google Scholar
11. Lei, T. and Moustakas, T. D., This volumeGoogle Scholar
12. JCPDF 9–12Google Scholar
13. JCPDF 12–377Google Scholar
14. Bar-Yam, Y., Lei, T., Moustakas, T. D., Allan, D. C. and Teter, M. P., This volumeGoogle Scholar
15. Fanciulli, M. and Moustakas, T. D., This volumeGoogle Scholar