Hostname: page-component-78c5997874-lj6df Total loading time: 0 Render date: 2024-11-17T23:29:15.920Z Has data issue: false hasContentIssue false
  • English
  • Français

Electromigration Induced Failure as a Function of Via Interface

Published online by Cambridge University Press:  10 February 2011

Larisa Kisselgof  and
J. R. Lloyd
Larisa Kisselgof
Affiliation:
Digital Equipment Corporation, 75 Reed Road Hudson MA 01749, kisselgof@bigq.enet.dec.com
J. R. Lloyd
Affiliation:
Lloyd Technology Associates, Inc., Box 194, Stow MA 01775, jlloyd@lta.ultranet.com
Get access

Abstract

Failure of test structures composed of pairs of W vias connected by lengths of Al/0.5%Cu conductor were compared as a function of the position of the via with respect to the conductor link. In one configuration, the current was passed from first level to a conductor link on second level and in the other the current was passed from second level to one on the first. In each case the links were identical in cross section, length and composition. There was a significant difference in the performance with respect to electromigration lifetime between these configurations as well as a difference in the failure mode. In the first level links, where the current passed first through a a 350A thick TiN ARC (Anti-Reflective Coating) layer and then a 150A Ti layer, the lifetime was significantly shorter than that of the second level samples where the current was passed across an interface of Al3Ti intermetallic compound. In addition, the failure mode was different, the first metal links failing directly under the via whereas in second metal link, the failures were away from the via in the metal link itself.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 401
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1) Filippi, R.G., Biery, G.A. and Wood, M.R., MRS Proc. Vol. 309, 141 (1993)Google Scholar
2) Blech, I.A. and Kinsbron, E., Thin Solid Films, 25, 327 (1975)Google Scholar
3) Ross, C.A., MRS Proc. Vol. 225, 35 (1991)Google Scholar
4) Lloyd, J.R., Sauber, J. and Walls, J.M., “Stress-Induced Phenomena in Metallization, Third International Workshop” edited by Ho, P.S., Bravman, J., Li, C.-Y. and Sanchez, J., AIP Conf. Proc. 373, 90 (1996)Google Scholar
5) Ting, Larry M., Dixit, G., Jain, M., Littau, K.A., Tran, H., Chang, M. and Sinha, A., MRS Proc. Vol. 391, 453 (1995)Google Scholar