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Ceramic-Polyimide Systems for Electronic Packaging

Published online by Cambridge University Press:  15 February 2011

Wayne E. Marsh ,
K. Kanakarajan  and
Garry D. Osborn
Wayne E. Marsh
Affiliation:
DuPont, Circleville Research Lab, Circleville, Ohio-43113
K. Kanakarajan
Affiliation:
DuPont, Circleville Research Lab, Circleville, Ohio-43113
Garry D. Osborn
Affiliation:
Summer Student Employee from the Miami University, Oxford, Ohio
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Abstract

A family of new high performance thermoplastic polyimide adhesives have been developed that can be directly laminated to ceramic substrates, polyimide films, metals, and/or sputter metallized for eventual circuit fabrication. We have also developed new heat-sealable composite polyimide films that have improved CTE, that have good dimensional stability and that can also be directly bonded to ceramic and glass-ceramic substrates. With these new material sets various constructions of ceramic-polyimide rigid-flex systems can be conceived to meet the more demanding needs of the electronics industry. We have laminated these films to metals and various ceramic substrates such as alumina, aluminum nitride, glass, etc. and investigated the bond stabilities under thermal and humidity aging conditions.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 304: Symposium H – Polymer/Inorganic Interfaces , 1993 , 91
Copyright
Copyright © Materials Research Society 1993

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References

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