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An Interactive System for Wafer Emissivity Estimation as Determined in an RTP Chamber

Published online by Cambridge University Press:  10 February 2011

Maurizio Fulco ,
Onofrio L. Russo ,
Sergey Belikov  and
Walter Kosonocky
Maurizio Fulco
Affiliation:
New Jersey Institute of Technology, Newark, NJ 07102
Onofrio L. Russo
Affiliation:
New Jersey Institute of Technology, Newark, NJ 07102
Sergey Belikov
Affiliation:
New Jersey Institute of Technology, Newark, NJ 07102
Walter Kosonocky
Affiliation:
New Jersey Institute of Technology, Newark, NJ 07102
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Abstract

We demonstrate an interactive software system in which the emissivity of wafers can be estimated in situ using different models. The system allows the data taker to introduce a choice of design parameters necessary for the control of temperature uniformity. The objective of the interactive system is to obtain a better estimation of the wavelength dependent emissivity by using existing data such as integrated emissivity, for example, as input information. Results for some of the models are presented and compared to show differences in the models chosen. The principle advantage offered by the system are the likely prospects of a realistic improvement and confident assessment for real time temperature measurement and control in an RTP environment.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 470: Symposium F – Rapid Thermal and Integrated Processing IV , 1997 , 29
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1. Belikov, S., Hur, D., Friedland, B., and Ravindra, N., in Rapid Thermal and Integrated Processing V (Mater. Res. Sos. Proc. 429, Pittsburgh, PA 1996), pp. 335–340.Google Scholar
2. Luenberger, D., IEEE Trans. Autom. Contr., AC–16, No. 6, p. 596- 602 (1971).Google Scholar
3. Friedland, B., Advanced Control System Design, Prentice Hall, Englewood Cliffs, NJ, 1996.Google Scholar
4. Mracek, C., Cloutier, J., and D'Souza, A., in Proc.5th IEEE Conf.on Control Applications. 1996.Google Scholar
5. LabVIEW User Manual, National Instruments, 1996.Google Scholar
6. G Math Toolkit Reference Manual, National Instruments, 1996.Google Scholar
7. Belikov, S. and Friedland, B., in Proc.34th IEEE Conf. Decision and Control. 1995, pp. 2476–2481.Google Scholar
8. 8. Kessler, F.R. and Schnell, J., Z. Naturforsch. 13a, 458 (1958).Google Scholar
9. Sato, T., Jpn. J. Appl. Phys. 6, 339 (1967).Google Scholar
10. Timans, P. J., in Rapid Thermal and Integrated Processes (ed. Roozeboom, F.), Kluwer Acad. Pubi., 1996, p. 35–101.Google Scholar
11. Friedland, B., Belikov, S., Hur, D., in The 9-th Yale Workshop on Adaptive and Learning Systems. 1996, pp. 143–148.Google Scholar
12. Moslehi, M., Lee, Y.J., Schaper, C., Omstesd, T., Velo, L., Kermani, A., and Davis, C., in Advances in Rapid Thermal and Integrated Processes, (ed. Roozeboom, F.), Kluwer Acad. Publisher, 1996, pp. 163–192.]Google Scholar