Hostname: page-component-78c5997874-m6dg7 Total loading time: 0 Render date: 2024-11-18T12:17:00.842Z Has data issue: false hasContentIssue false
  • English
  • Français

ACID/BASE Interactions with Silicon Carbide Fiber

Published online by Cambridge University Press:  21 February 2011

Sheldon P. Wesson  and
Ronald E. Allred
Sheldon P. Wesson
Affiliation:
TRi/Princeton, P. O. Box 625, Princeton, NJ 08542
Ronald E. Allred
Affiliation:
PDA Engineering, Materials Development Department, 3754 Hawkins NE, Albuquerque, NM 87109
Get access

Abstract

Silicon carbide fiber surfaces were analyzed by programmed thermal desorption and inverse gas chromatography, using Lewis acids and bases as probe adsorbates to compare the effect of RF glow discharge plasma and thermal treatment on surface energetics. Changes in surface acid/base character were correlated with wetting data, surface titrations, and surface chemical composition deduced from x-ray photoelectron spectroscopy. Thermal treatment did not alter fiber surface energetics significantly. Plasma treatment rendered the surface more acidic and more basic. XPS and thermal desorption analysis indicate that the plasma removed: strongly adsorbed organic contaminants, exposing and activating the underlying glassy surface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 170: Symposium N – Interfaces in Composites , 1989 , 135
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Hasegawa, Y. and Okamura, K., J. Mater. Sci. 21, 321, (1986).Google Scholar
2. Petrisco, R.A. and Stark, G.L., 33rd Int. SAMPE Exh. Proc., 13, (1987); SAMPE Eng. Series 33, 1015, (1988).Google Scholar
3. Wesson, S.P. and Allred, R.E., in Inverse Gas Chromatography, edited by Lloyd, D.R., Ward, T.C. and Schreiber, H.P. (ACS Symposium Series 391, Washington DC, 1989), p.203.Google Scholar