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Measurement of Low-k Polymerimetal Interfacial Toughness Using 4-point Bending Method

Published online by Cambridge University Press:  15 February 2011

Qing Ma ,
Chuanbin Pan ,
Harry Fujimoto ,
Baylor Triplett ,
Peter Coon  and
Chien Chiang
Qing Ma
Affiliation:
Intel Corporation, Santa Clara, CA 95052
Chuanbin Pan
Affiliation:
Intel Corporation, Santa Clara, CA 95052
Harry Fujimoto
Affiliation:
Intel Corporation, Santa Clara, CA 95052
Baylor Triplett
Affiliation:
Intel Corporation, Santa Clara, CA 95052
Peter Coon
Affiliation:
Intel Corporation, Santa Clara, CA 95052
Chien Chiang
Affiliation:
Intel Corporation, Santa Clara, CA 95052
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Abstract

Four-point bending method offers significant advantages over more traditional techniques in measuring adhesion properties of thin polymer films. The former utilizes sandwich structure beams where the polymer film and the interface of interest are placed at the center of two elastic bulks. Such confined geometry closely resembles applications where polymer films are used as dielectric layers in IC interconnect technology. In this work, the bonding between a poly(arylene ether) (PAE) based polymer film and an Al film was studied. Ti layers of several different thickness were used as adhesion promoter. The sandwich samples were made by bonding bulk wafers using an epoxy. Fracture energies were seen to increase with the thickness of the Ti layer. Effects of heat treatment were also studied.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 379
Copyright
Copyright © Materials Research Society 1997

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References

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