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Evaluation and Testing of Organometallic Precursor for Copper Direct-Write

Published online by Cambridge University Press:  17 March 2011

Prodyut Majumder ,
Manish Tiwari ,
Constantine Megaridis ,
James McAndrew ,
Mindi Xu ,
John Belot  and
Christos G Takoudis
Prodyut Majumder
Affiliation:
Department of Chemical Engineering, University of Illinois at Chicago, 810 S Clinton St, Chicago, IL, 60607
Manish Tiwari
Affiliation:
Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, 842 W Taylor Street, Chicago, IL, 60607
Constantine Megaridis
Affiliation:
Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, 842 W Taylor Street, Chicago, IL, 60607
James McAndrew
Affiliation:
American Air Liquide, 200 GBC Drive, Newark, DE, 19702
Mindi Xu
Affiliation:
American Air Liquide, 200 GBC Drive, Newark, DE, 19702
John Belot
Affiliation:
Department of Chemistry, University of Nebraska, 516 Hamilton Hall, Lincoln, NE, 68588
Christos G Takoudis
Affiliation:
Department of Chemical Engineering, University of Illinois at Chicago, 810 S Clinton St, Chicago, IL, 60607 Department of Bioengineering, University of Illinois at Chicago, 851 S Morgan St, Chicago, IL, 60607
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Abstract

A capillary bridge printing technique has been used to deposit copper interconnects using homogeneous solutions of a Cu(II) precursor in a series of low boiling primary alcohols. The rheological properties of the solutions have been measured first to determine their printability. The as-printed lines with subsequent annealing at relatively low temperatures (∼200 °C), in order to evaporate the volatile solvents and facilitate dissociation of the precursor deposit, produced conducting interconnects. The precursor has been demonstrated to be self-reducing and requires no reducing environment (e.g. H2) thus making the interconnect formation easier. Moreover, successful decomposition of the precursor into metallic Cu at such low temperatures holds promise for applications involving flexible polymer substrates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1002: Symposium N – Printing Methods for Electronics, Photonics and Biomaterials , 2007 , 1002-N07-23
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

[1] Curtis, C., Rivkin, T., Miedaner, A., Alleman, J., Perkins, J., Smith, L., and Ginley, D., Proceedings - NCPV Program Review Meeting, Lakewood, CO, United States, Oct. 14-17, pp. 249–252, 2001.Google Scholar
[2] Curtis, C. J., Schulz, D. L., Miedaner, A., Alleman, J., Rivkin, T., Perkins, J. D., and Ginley, D. S., Materials Research Society Symposium Proceedings, vol. 676, pp. Y8.6.1–Y8.6.6, 2001.CrossRefGoogle Scholar
[3] Schulz, D. L., Curtis, C. J., and S, D., Electrochemical and Solid-State Letters, vol. 4, pp. C58–C61, 2001.CrossRefGoogle Scholar
[4] Bao, Z., Feng, Y., Dodabalapur, A., Raju, V. R., and Lovinger, A. J., Chemistry of Materials, vol 9, pp.1299–1301, 1997 CrossRefGoogle Scholar
[5] Hong, C. M., and Wagner, S., IEEE Electron Device Letters, vol. 21, pp. 384–386, 2000.CrossRefGoogle Scholar
[6] Rivkin, T., Curtis, C. J., Miedaner, A., Alleman, J., Schulz, D. L., and Ginley, D. S., Proceedings - Electrochemical Society, vol. 2000–27, pp. 80–89, 2001.Google Scholar
[7] Volkman, S. K., Pei, Y., Redinger, D., Yin, S., and Subramanian, V., Materials Research Society Symposium Proceedings, vol. 814, pp. 151–156, 2004.CrossRefGoogle Scholar
[8] Rozenberg, G. G., Bresler, E., Speakman, S. P., Jeynes, C., and Steinke, J. H. G., Applied Physics Letters, vol. 81, pp. 5249–5251, 2002.CrossRefGoogle Scholar
[9] Jeynes, C., Rozenberg, G. G., Speakman, S. P., and Steinke, J. H. G., Nuclear Instruments & Methods in Physics Research Section B, vol. 188, pp. 141–145, 2002.CrossRefGoogle Scholar
[10] Szczech, J., Megaridis, C., Zhang, J., and Gamota, D., Microscale Thermophysical Engineering, vol. 8, pp. 327–339, 2004.CrossRefGoogle Scholar
[11] Szczech, J. B., Megaridis, C. M., Gamota, D. R., and Zhang, J., IEEE Transactions on Electronics Packaging Manufacturing, vol. 25, pp. 26–33, 2002.CrossRefGoogle Scholar
[12] Kydd, P. H., Wagner, S., and Gleskova, H., U. S. Patent 6274412, 1999.Google Scholar
[13] Drummond, T., Arbor, A., and Ginley, D., U. S. Patent 5132248, 1992.Google Scholar
[14] Kim, Y., Kim, C. G., Chung, T.-M., Lee, S. S., An, K.-S., Yang, T. S., and Jang, H. S., in U.S. Us: (Korea Research Institute of Chemical Technology, S. Korea), pp. 16, 2006.Google ScholarPubMed
[15] Temple, D. and Reisman, A., Journal of The Electrochemical Society, vol. 136, pp. 3525–3529, 1989.CrossRefGoogle Scholar
[16] Goel, S. C., Kramer, K. S., Chiang, M. Y., and Buhro, W. E., Polyhedron, vol. 9, pp. 611–13, 1990.CrossRefGoogle Scholar
[17] Young, V. L., Fox, D. F., and Davis, M. E., Chemistry of Materials, vol. 5, pp. 1701–9, 1993.CrossRefGoogle Scholar
[18] http://www.microfab.com/equipment/pdf/MicroJet_Dev_Spec.pdf.Google Scholar