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Development of a Composite Tape Conductor of Y-Ba-Cu-O

Published online by Cambridge University Press:  28 February 2011

R.D. Blaugher ,
D.W. Hazelton ,
J.A. Rice  and
M.S. Walker
R.D. Blaugher
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
D.W. Hazelton
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
J.A. Rice
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
M.S. Walker
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
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Abstract

Samples of a prototype composite tape conductor have been prepared consisting of a thick layer of Y Ba2 Cu3 O7 (123) on a metallic substrate. A thick coating of 123 precursor powder was applied to the substrate by a mechanical compaction process. A melt-quench-growth technique was then employed to effect a textured grain development and improved current density. The resulting melt processed structure showed a textured 123 orthorhombic matrix with a dispersion of the 211 phase. The orthorhombic 123 phase was highly developed with an onset temperature of 90K and current density near 104 A/cm2 at 4T and 50K measured by a steady-state magnetization method.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 169: Symposium M – High Temperature Superconductors: Fundamental Properties and Novel Materials Processing , 1989 , 1205
Copyright
Copyright © Materials Research Society 1990

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References

1 Nagato, M., Ohmata, K, Mukai, H., Hikata, T., Hosoda, Y., Shibuta, N., Sato, K., Hitosuyanagi, H., Kawashima, M., Materials for Cryogenic Technology Symposium, May 15–16,1989, Japan.Google Scholar
2 Jin, S., Trefel, T.H., Sherwood, R.C., Davis, M.E., VanDover, R.B., Kammloff, G.W., Fastnacht, R.A., Keith, H.D., Appl. Phys. Lett., 52, p. 2075, 1988.Google Scholar
3 Details on the metallic substrate will be published at a later date.Google Scholar
4 Murakami, M., Morita, M., Miyamoto, K., Matsuda, S., to be published in Proc. Osaka Univ. Int. Symp. on New Developments in Applied Superconductivity, Osaka, 1988.Google Scholar
5 Blaugher, R.D., Hazelton, D.W., Rice, J.A., to be published Proc. of the Conf. on Superconducting Materials and Applications, Buffalo, NY, Sept. 19–22, 1989.Google Scholar
6 Bean, C.P., Phys. Rev. Lett., 8, p. 250,1962.Google Scholar