Hostname: page-component-78c5997874-t5tsf Total loading time: 0 Render date: 2024-11-17T23:18:14.962Z Has data issue: false hasContentIssue false
  • English
  • Français

Material Shear Strength Assessment of AU/20SN Interconnection for High Temperature Applications

Published online by Cambridge University Press:  02 August 2018

L. L. Liao  and
K. N. Chiang
L. L. Liao
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan Electronic and Optoelectronics Research LaboratoriesIndustrial Technology Research InstituteHsinchu, Taiwan
K. N. Chiang*
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan Advanced Packaging Research CenterNational Tsing Hua UniversityHsinchu, Taiwan
*
*Corresponding author (knchiang@pme.nthu.edu.tw)
Get access

Abstract

When a power module is under a continuous electrical load, a temperature effect is induced by the current load in the module configuration. The joint material therefore has long-term temperature and mechanical loadings under supplied power. A long-term temperature load can change the material and mechanical properties, including voiding, cracking, creeping and fracturing. Au/20Sn eutectic alloy, a highly temperature resistant material, is typically used for electric interconnections in high-power modules. The Au/20Sn is converted into AuSn and an Au5Sn intermetallic compound (IMC) by solid liquid inter-diffusion (SLID) bonding to form joints with high melting points. In this study, a test vehicle based on an actual power module was designed and fabricated to investigate and understand the material properties and mechanical behavior of Au/20Sn solder under a temperature load. The joint microstructure exhibited variation under different thermal treatment conditions such as temperature and load durations. The shear strength test was conducted to examine the mechanical strength of the joints under different thermal load conditions. The failure mode of the joint was further determined using fracture morphology after the shear test. Finally, the shear strength of Au/20Sn was identified to investigate the high temperature resistance of joints under different temperatures. The mechanical strengths of joints under different temperature loads are expressions of different mechanical characteristics and can be used to determine reliability at an intended high application temperature.

Keywords

Mechanical strengthAu/20Sn eutectic alloyIntermetallic compoundSolid liquid interdiffusionHigh-power modulesShear strength test
Type
Research Article
Information
Journal of Mechanics , Volume 35 , Issue 1 , February 2019 , pp. 81 - 91
Copyright
Copyright © The Society of Theoretical and Applied Mechanics 2019 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Hung, T. Y., Chiang, S. Y., Huang, C. J., Lee, C. C. and Chiang, K. N., “Thermal-Mechanical Behavior of the Bonding Wire for a Power Module Subjected to the Power Cycling Test,” Microelectronics Reliability, 51, pp. 1819–1823 (2011).Google Scholar
2. Liao, L. L. and Chiang, K. N., “Nonlinear and Temperature-Dependent Material Properties of Au/Sn Alloy for Power Module,” Journal of Mechanics, 33, pp. 663–672 (2017).Google Scholar
3. Lang, F., Nakagawa, H., Aoyagi, M., Ohashi, H. and Yamaguchi, H., “A Novel Chip Joint Method for High Temperature Operated SiC Power Modules,” Proceedings 8th Electronics Packaging Technology Conference, Singapore, pp. 597–603 (2006).Google Scholar
4. Lang, F., Hayashi, Y., Nakagawa, H., Aoyagi, M. and Ohashi, H., “A Novel Three-Dimensional Packaging Method for Al-Metalized SiC Power Devices,” IEEE Transactions on Advanced Packaging, 32, pp. 773–779 (2009).Google Scholar
5. Hagler, P., Johnson, R. W. and Chen, L. Y., “SiC Die Attach Metallurgy and Processes for Applications up to 500 degC,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 1, pp. 630–639 (2011).Google Scholar
6. Lee, N. C., “Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects,” Proceedings International Conference Surface Mount Technology Association (SMTA), Chicago, IL, USA (2000).Google Scholar
7. Bernstein, L., “Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process: I. The Systems Ag-In, Au-In, and Cu-In,” Journal of The Electrochemical Society, 113, pp. 1282–1288 (1966).Google Scholar
8. Jacobson, D. M. and Humpston, G., “Diffusion Soldering,” Soldering & Surface Mount Technology, 4, pp. 27–32 (1992).Google Scholar
9. Lee, C. C., Wang, C. Y. and Matijasevic, G., “Advances in Bonding Technology for Electronic Packaging,” Journal of Electronic Packaging, 115, pp. 201–207 (1993).Google Scholar
10. Okamoto, H., “Au-Sn (Gold-Tin),” Journal of Phase Equilibria and Diffusion, 28, pp. 490 (2007).Google Scholar
11. Suganuma, K., Kim, S. J. and Kim, K. S., “High-Temperature Lead-Free Solders: Properties and Possibilities,” Journal of Management, 61, pp. 64–71 (2009).Google Scholar
12. Lang, F., Nakagawa, H., Aoyagi, M., Ohashi, H. and Yamaguchi, H., “Impact of Joint Materials on the Reliability of Double-Side Packaged SiC Power Devices during High Temperature Aging,” Journal of Materials Science: Materials in Electronics, 21, pp. 917–925 (2010).Google Scholar
13. Lang, F., Hayashi, Y., Nakagawa, H., Aoyagi, M. and Ohashi, H., “Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders,” Proceedings. 10th Electronics Packaging Technology Conference, Singapore, pp. 897–902 (2008).Google Scholar
14. Tollefsen, T., Larsson, A., Løvvik, O. and Aasmundtveit, K., “Au-Sn SLID Bonding-Properties and Possibilities,” Metallurgical & Materials Transactions B, 43, pp. 397–405 (2012).Google Scholar
15. Oppermann, H., The Role of Au/Sn Solder in Packaging, Springer London, pp. 377 (2005).Google Scholar
16. Anhock, S. et al., “Investigations of Au-Sn Alloys on Different End-Metallizations for High Temperature Applications [Solders],” Proceedings. 22th International Electronics Manufacturing Technology Symposium, Berlin, Germany, pp. 156–165 (1998).Google Scholar
17. Tollefsen, T. et al., “Au-Sn SLID Bonding: A Aeliable HT Interconnect and Die Attach Technology,” Metallurgical and Materials Transactions B, 44, pp. 406–413 (2013).Google Scholar
18. Tollefsen, T., Løvvik, O., Aasmundtveit, K. and Larsson, A., “Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond,” Metallurgical and Materials Transactions A, 44, pp. 2914–2916 (2013).Google Scholar
19. Yoon, J. W., Chun, H. S. and Jung, S. B., “Reliability Evaluation of Au–20Sn Flip Chip Solder Bump Fabricated by Sequential Electroplating Method with Sn and Au,” Materials Science and Engineering: A, 473, pp. 119–125 (2008).Google Scholar
20. Kim, S. S., Kim, J. H., Booh, S. W., Kim, T. G. and Lee, H. M., “Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and UBM,” Materials Transactions, 46, pp. 2400–2405 (2005).Google Scholar
21. Song, H. G., Ahn, J. P. and Morris, J. W., “The Microstructure of Eutectic Au-Sn Solder Bumps on Cu/Electroless Ni/Au,” Journal of Electronic Materials, 30, pp. 1083–1087 (2001).Google Scholar
22. Jang, S. Y. et al., “Pb-Free Sn/3.5Ag Electroplating Bumping Process and under Bump Metallization (UBM),” IEEE Transactions on Electronics Packaging Manufacturing, 25, pp. 193–202 (2002).Google Scholar
23. Wei, X. F., Wang, R. C., Peng, C. Q., Feng, Y. and Zhu, X. W., “Microstructural Evolutions of Cu(Ni)/ AuSn/Ni Joints during Reflow,” Progress in Natural Science: Materials International, 21, pp. 347–354 (2011).Google Scholar
24. Wei, X. F., Zhang, Y. K., Wang, R. C. and Feng, Y., “Microstructural Evolution and Shear Strength of AuSn20/Ni Single Lap Solder Joints,” Microelectronics Reliability, 53, pp. 748–754 (2013).Google Scholar