Symposium E – Chemical-Mechanical Polishing 2000 - Fundamentals…
Research Article
Fundamental Study of Iodate and Iodine Based Slurries for Copper CMP
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- 14 March 2011, E7.8.1
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Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films
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- 14 March 2011, E8.6.1
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Using Wafer-Scale Patterns for CMP Analysis
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- 14 March 2011, D11.8.1/E8.8.1
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Interfacial Fluid Pressure and Its Effects on SiO2 Chemical Mechanical Polishing
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- 14 March 2011, E7.1.1
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Planarization of Cu and Ta Using Silica and Alumina Abrasives - A Comparison
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- 14 March 2011, E2.4.1
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A Model of Chemical Mechanical Polishing
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- 14 March 2011, E1.4.1
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Performance of Polishing Slurries containing Silica Particles grown by Sol-Gel Method
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- 14 March 2011, E6.5.1
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Multi-Level Damascene Process Development: Aluminum CMP
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- 14 March 2011, E4.3.1
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The characteristics of the Electrolyzed D.I.water with chemicals and the outline of the supply system
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- 14 March 2011, E5.4.1
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A Novel Single Step Lapping and Chemo-Mechanical Polishing Scheme for Antimonide Based Semiconductors Using 1 µm Agglomerate-Free Alumina Slurry
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- 14 March 2011, E4.1.1
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Fundamental Studies on the Mechanisms of Oxide CMP
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- 14 March 2011, E1.7.1
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Dynamic Mechanical Analysis (DMA) of CMP pad materials
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- 14 March 2011, E7.3.1
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A New Poly-Si CMP Process with Small Erosion for Advanced Trench Isolation Process
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- 14 March 2011, E5.3.1
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Technique of surface control with the Electrolyzed D.I.water for post CMP cleaning
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- 14 March 2011, E8.3.1
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An Evaluation of the Effects of Benzotriazole in NH4OH Slurry for Copper CMP
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- 14 March 2011, E7.4.1
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Modeling on Mechanical Properties of Polishing Pads in CMP Process
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- 14 March 2011, E1.5.1
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An Image Analysis Technique For Assessing Particle Size And Agglomeration Tendency Of Slurries
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- 14 March 2011, E6.1.1
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The Effect of Wafer Shape on Slurry Film Thickness and Friction Coefficients in Chemical Mechanical Planarization
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- 14 March 2011, E1.2.1
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Improvement of Wafer Edge Profile and Cmp Performance Through The Floating Head Design
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- 14 March 2011, E5.1.1
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Chemical Wear of Cu CMP
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- 14 March 2011, E2.5.1
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