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Chemical Wear of Cu CMP

  • Hong Liang (a1)

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In this work, we used surface analysis techniques, such as a field-emission highresolution analytical TEM, X-ray spectroscopy, and XPS to analyze abrasive particles after polishing. Results showed evidence of copper oxide (Cu2O) in the polished slurry. However, there was no metallic crystalline copper detected. After comparing these data with the results obtained from our electro-chemical experiments, we propose two possible chemical wear mechanisms in Cu CMP.

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Chemical Wear of Cu CMP

  • Hong Liang (a1)

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