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Chemical Wear of Cu CMP

  • Hong Liang (a1)


In this work, we used surface analysis techniques, such as a field-emission highresolution analytical TEM, X-ray spectroscopy, and XPS to analyze abrasive particles after polishing. Results showed evidence of copper oxide (Cu2O) in the polished slurry. However, there was no metallic crystalline copper detected. After comparing these data with the results obtained from our electro-chemical experiments, we propose two possible chemical wear mechanisms in Cu CMP.



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1 Larsen-Basse, J. and Liang, H., “Probable Roles of Abrasive Particles in W CMP,” Wear, 233–235, 647654, 1999.10.1016/S0043-1648(99)00248-3
2 Kaufman, F. B., Thompson, D. B., Broadie, R. E., Jaso, M. A., Gutherie, W. L., Pearson, D. J. and Small, M. B., “Chemical-Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects,” J. Electrochem. Soc., 138, 3460, 1991.10.1149/1.2085434
3 Stein, D., Hetherington, d., Guilinger, T., and Cecchi, J., “In Situ Electrochemical Investigation of Tungsten Electrochemical Behavior during Chemical Mechanical Polishing,” J. Eletrochem. Soc., 145, 3190, 1998.10.1149/1.1838785
4 Martin, J. M., Mogne, Th. Le, Boehm, M., and Grossiord, C., “Tribochemisty in the Analytical UHV Tribometer,” Trib. Int., in press.
5 Martin, J. M., Mogne, Th. Le, Grossiord, C., and Palermo, Th., “Tribochemistry in the Analytical UHV Tribometer,” Trib. Let., 3, 8794, 1997.10.1023/A:1019183711497
6 Martin, J.M., “Antiwear Mechanisms of Zinc Dithiophosphate: a Chemical Hardness Approach,” Tribology Letters, Vo. 6, 18, 1999.10.1023/A:1019191019134
7 Dickinson, J.T., Park, N.-S., Kim, M-W., and Langford, S.C., “A Scanning Force Microscope Study of a Tribochemical System: Stress-Enhanced Dissolution,” Trib. Lett. 3, 6980, 1997.10.1023/A:1019135828336
8 Varlot, K., Martin, J. M., Grossiord, C., Vacher, B., and Inoue, K., “A Dual Analysis Approach in Tribochemistry: Application to ZDDP/calcium Borate Additive Interactions,” Trib. Letters.
9 Brusic, B., Scherber, D., Kaufman, F., Kistler, R., and Streinz, C., “Electrochemical Approach to Au and Cu CMP Process Development,” The Electrochemical Society Proceedings, V. 96-22, 176185, 1997.
10 Brusic, V. and Liang, H., Private Conversation.
11 Brusic, V., Frisch, M. A., Eldridge, B. N., Novak, F. P., Kaufman, F. B., Rush, B. M., and Frankel, G. S., Copper Corrosion with and without Inhibitors,” J. Electrochem. Soc., Vol. 138, No. 8, 22532259, 1991.10.1149/1.2085957

Chemical Wear of Cu CMP

  • Hong Liang (a1)


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