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Fundamental Study of Iodate and Iodine Based Slurries for Copper CMP

Published online by Cambridge University Press:  14 March 2011

Seung-Mahn Lee ,
Uday Mahajan ,
Zhan Chen  and
Rajiv K. Singh
Seung-Mahn Lee
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
Uday Mahajan
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
Zhan Chen
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
Rajiv K. Singh
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
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Abstract

The chemical mechanical polishing of copper in several slurry chemistries based on iodate and iodine oxidizers has been investigated. Benzotriazole (BTA) and potassium iodide (KI) were used for preparing the polishing slurry chemistries based iodate. As observed by the anodic electrochemical behavior of copper and the surface analyses of EDS, it was determined that CuI layer formed in the iodate and iodine based solutions. Especially, in I2 slurry in pH 4, CuI layer formed very fast and uniformly, and passivated the copper. In addition, the highest removal rate using this slurry was obtained. These results were compared to H2O2 based slurries. From these experimental results, the slurry containing 0.1M KIO3 and 0.01M KI, and 0.01N I2 give better results than H2O2 based slurry in copper CMP.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 613: Symposium E – Chemical-Mechanical Polishing 2000 - Fundamentals… , 2000 , E7.8.1
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCE

1. Kaufman, F. B., Thompson, D. B., Broadie, R. E., Jaso, M. A., Guthrie, W. L., Pearson, D. J. and Small, M. B., J. Electrochem. Soc., 138, 3460 (1991)10.1149/1.2085434Google Scholar
2. Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J., Chemical mechanical planarization of microelectronic materials, John Wiley and Sons, New York (1997)10.1002/9783527617746Google Scholar
3. Carpio, R., Farkas, J. and Jairath, R., Thin Solid Films, 266, 238 (1995)10.1016/0040-6090(95)06649-7Google Scholar
4. Luo, Q., Ramarajan, S. and Babu, S. V., Thin Solid Films, 335, 160 (1998)10.1016/S0040-6090(98)00896-7Google Scholar
5. Rutten, M., Feeney, P., Cheek, R., and Landers, W., Semiconductor Int., 123 (Aug. 1995)Google Scholar
6. Stavreva, Z., Zeidler, D., Plotner, M., and Drescher, K.. Appl. Surf. Sci., 91, 192 (1995)10.1016/0169-4332(95)00118-2Google Scholar
7. Steigerwald, J. M., Murerka, S. P., Gutmann, R. J., and Duquette, D. J., J. Vac. Sci. Technol., 13B, 2215 (1995)10.1116/1.588106Google Scholar
8. Steigerwald, J. M., Murerka, S. P., Gutmann, R. J., and Duquette, D. J., Mater. Chem. Phys. 41, 217 (1995)10.1016/0254-0584(95)01516-7Google Scholar
9. Pourbaix, M., Atlas of Electrochemical Equilibria in Aqueous Solution, NACE, Houston, TX 1974 Google Scholar
10. Bielmann, M., Mahajan, U., and Singh, R. K., Electrochem. and Solid-state lett., 2, 401 (1999)10.1149/1.1390851Google Scholar
11. Bielmann, M., Mahajan, U., Singh, R. K., Shah, D. O., and Palla, B. J., Electrochem. and Solid-state lett., 2, 148 (1999)10.1149/1.1390765Google Scholar
12. Wu, Y. C., Zhang, P., Pickering, H. W. and Allara, D. L., J. Electrochem. Soc., 140, 2791 (1993)10.1149/1.2220912Google Scholar
13. Schweinsberg, D. P., Bottle, S. E., and Otieno-Alego, V., J. Appl. Electrochem., 27, 161 (1997)10.1023/A:1018447806449Google Scholar
14. Lee, S-M, Mahajan, U., Chen, Z. and Singh, R. K., Proceeding of the Electrochemical Society, 1999 Fall.Google Scholar
15. Tromans, D. and Silva, J., J. Electrochem. Soc., 143, 458 (1996)10.1149/1.1836465Google Scholar