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The characteristics of the Electrolyzed D.I.water with chemicals and the outline of the supply system

  • Mitsuhiko Shirakashi (a1), Kenya Itoh (a1), Ichiro Katakabe (a1), Mamabu Tsujimura (a1), Takayuki Saitoh (a2), Kaoru Yamada (a2), Naoto Miyashita (a3), Masako Kodera (a3) and Yoshitaka Matsui (a3)...

Abstract

In semiconductor device production, wafers are treated through many cleaning processes. Usually, several chemicals are used so as to match for several purposes like RCA cleaning method. As wafer size becomes larger, large amount of cleaning chemicals usage and waste are necessary, which becomes now a big problem. Considering the above, we developed the Electrolyzed D.I.water with chemicals supply system in order to minimize running cost of chemicals and waste treatment. It is feature that; 1) this system can generate the anode water of the acidity/high ORP (Oxidation-Reduction Potential) and the cathode water of the alkalinity/low ORP by electrolyzing D.I.water adding with a small quantity of chemicals; 2) this system can generate anode water and cathode water at the same time; 3) if necessary, the anode water can be diluted with D.I.water at the optional density, and it is possible with the cathode water that hydrogen peroxide is added. The anode water which shows acidity/high ORP has the effect of removing metal and organic contamination, and the cathode water which shows alkalinity/low ORP has the effect of particle removal. In this report, we explain the outline of this system and the basic characteristic of the Acid and Alkaline water made with this system and its performances.

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Kashiwagi, M. Hattori, A.: ”Cleaning technology of wafer surface”, Realize INC.

The characteristics of the Electrolyzed D.I.water with chemicals and the outline of the supply system

  • Mitsuhiko Shirakashi (a1), Kenya Itoh (a1), Ichiro Katakabe (a1), Mamabu Tsujimura (a1), Takayuki Saitoh (a2), Kaoru Yamada (a2), Naoto Miyashita (a3), Masako Kodera (a3) and Yoshitaka Matsui (a3)...

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