Skip to main content Accessibility help
×
Home

Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films

  • Benjamin A. Bonner (a1), Boris Fishkin (a1), Jeffrey David (a1), Chad Garretson (a1) and Thomas H. Osterheld (a1)...

Abstract

Wafers where deposited with BPSG films having phosphorus concentration varying from 3.65 to 6.25% and boron concentration varying from 4 to 5.7%. These wafers were polished using CMP and the rates were found to depend on dopant concentrations. A fit to the data indicated that removal rates were more than 3 times as sensitive to boron concentration compared to phosphorus concentration. For a constant phosphorus concentration of 5%, each percent increase in boron increases CMP removal rate by 340 Å/min. For a constant boron concentration of 5%, each percent increase in phosphorus increases CMP removal rate by 96 Å/min.

Copyright

References

Hide All
1 Fang, S. J., Garza, S., Guo, H. et al. , “Optimization of the Chemical Mechanical Polishing Process for Premetal Dielectrices,” Journal of the Electrochemical Society 147 (2), 682 (2000).10.1149/1.1393253
2 Ni, C.-T., Chen, H. C., Huang, D. et al. , “A Study of CMP Slurry Chemistry Effect on BPSG Film for Advanced DRAM Application,” presented at the Proceedings of Third International Chemical-Mechanical Planarization for the ULSI Multilevel Interconnection Conference (CMP-MIC), Santa Clara, CA, 1998 (unpublished).
3 Steigerwald, Joseph M., Murarka, Shyam P., and Gutmann, Ronald J., Chemical Mechanical Planarization of Microelectronic Materials, 1 ed. (John Wiley & Sons, Inc., New York, 1997).10.1002/9783527617746
4 Yoshimaru, M. and Wakamatsu, H., “Microcrystal Growth on Borophosphosilicate Glass Film during High-Temperature Annealing,” Journal of the Electrochemical Society 143 (2), 666 (1996).10.1149/1.1836497
5 Schaffer, W.J., Westphal, J. W., Fry, H. W., et al. , “CMP Removal Rate and Nonuniformity of BPSG,” presented at the Proceedings of First International Chemical-Mechanical Planarization for the ULSI Multilevel Interconnection Conference (CMP-MIC), Santa Clara, CA, 1996 (unpublished).
6 Pennington, S. and Luce, S., Proc. 9th VMIC 9 (92), 168 (1992).
7 Sun, S. C., Yeh, F. L., and Tien, H. Z., Mat. Res. Soc. Symp. Proc. 337, 139 (1994).10.1557/PROC-337-139

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed