7 results
Influence of Electrochemical Plating Process Parameters on Corrosion of Cu Damascene Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K6.1
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- 2004
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Cross-Section Nano-Indentation for Rapid Adhesion Evaluation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 812 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, F5.5
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- 2004
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On factors affecting the extraction of elastic modulus by nanoindentation of organic polymer films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 841 / 2004
- Published online by Cambridge University Press:
- 01 February 2011, R5.2
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- 2004
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Grain Growth, Stress, and Impurities in Electroplated Copper
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- Journal:
- Journal of Materials Research / Volume 17 / Issue 3 / March 2002
- Published online by Cambridge University Press:
- 31 January 2011, pp. 582-589
- Print publication:
- March 2002
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A Quantitative Study of the Adhesion Between Copper, Barrier and Organic Low-K Materials
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D1.4.1
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- 2000
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Tailoring the Optical Properties of Si Nanocrystals In SiO2: Materials Issues And Nanocrystal Laser Perspectives
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- Journal:
- MRS Online Proceedings Library Archive / Volume 486 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 213
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- 1997
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Ion Beam Synthesis of Luminescent Si and Ge Nanocrystals in a Silicon Dioxide Matrix
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- Journal:
- MRS Online Proceedings Library Archive / Volume 321 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 363
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- 1993
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