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Cross-Section Nano-Indentation for Rapid Adhesion Evaluation

  • S. H. Brongersma (a1), Dominiek Degryse (a1), Jerome Souiller (a1), Bart Vandevelde (a1) and K. Maex (a1) (a2)...

Abstract

Cross-section nano-indentation is a technique that consists of cleaving a wafer, indenting behind the stack on the side surface causing delamination, and measuring the delaminated area in an optical microscope. It is shown to be a reliable rapid technique for adhesion evaluation and process optimization of the SiO2/barrier/copper stack.

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1 Ma, Q., Fujimoto, H., Flinn, P., Jain, V., Adibi-Rizi, F., Moghadam, F., and Dauskardt, R. H.. Mater. Res. Soc. Symp. Proc. 391, 91 (1995).
2 Sanchez, J. M., El-Mansy, S., Sun, B., Sherban, T., Fang, N., Pantuso, D., Ford, W., Elizalde, M. R., Martinez-Esnaola, J. M., Martin-Meizoso, A., Gil-Sevillano, J., Fuentes, M., and Maiz, J., Acta Mater. 47, 4405 (1999).

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