In this article, we present a study of boron-doped hydrogenated nanocrystalline silicon (nc-Si: H) films by very high frequency-plasma enhanced chemical vapor deposition (VHF-PECVD) using high deposition pressure. Electrical, structural and optical properties of the films were investigated. Dark conductivity as high as 2.75S/cm of p-type nc-Si: H prepared at 2.5Torr pressure has been achieved at a deposition rate of 1.75Å/s for 25nm thin film. By controlling boron and phosphorus contamination, single junction nc-Si: H solar cells incorporated p-layers prepared under high pressure and low pressure, respectively, were deposited. It has been proven that nanocrystalline silicon solar cells with incorporation of p layer prepared at high pressure has resulted in enhanced open circuit voltage, short circuit current density and subsequently high conversion efficiency. Through the optimization of the bottom solar cell and application of ZnO/Al back reflector, 10.59% initial conversion efficiency of micromorph tandem solar cell (1.027cm2) with an open circuit voltage of 1.3864V, has been fabricated, where the bottom solar cell using a high pressure p layer was deposited in a single chamber.

This paper reports results on the use of a pi’n/pin a-SiC:H heterostructure as an active band-pass filter transfer function whose operation depends on the wavelength of the trigger light, on the applied voltage and on the wavelength of the additional optical bias.

Results show that the device combines the demultiplexing operation with the simultaneous photodetection and self amplification of the signal. Experimental and simulated results show that the output signal has a strong nonlinear dependence on the light absorption profile. The device, modeled by a simple circuit with variable capacitors and interconnected phototransistors through a resistor, is a current-controlled device. It uses a changing capacitance to control the power delivered to the load acting as a state variable filter circuit. It combines the properties of active high-pass and low-pass filter sections into a capacitive active band-pass filter.

Mixed-phase thin film materials, consisting of nanocrystalline semiconductors embedded within a bulk semiconductor or insulator, have been synthesized in a dual-chamber co-deposition system. A flow-through plasma reactor is employed to generate nanocrystalline particles, that are then injected into a second, capacitively-coupled plasma deposition system in which the surrounding semiconductor or insulating material is deposited. Raman spectroscopy, X-ray diffraction and high resolution TEM confirm the presence of nanocrystals homogenously embedded throughout the a-Si:H matrix. In undoped nc-Si within a-Si:H (a/nc-Si:H), the dark conductivity increases with crystal fraction, with the largest enhancement of several orders of magnitude observed when the nanocrystalline density corresponds to a crystalline fraction of 2 – 4%. These results are consistent with the nc donating electrons to the surrounding a-Si:H matrix without a corresponding increase in dangling bond density for these films. In contrast, charge transport in n-type doped a/nc-Si:H films is consistent with multi-phonon hopping, possibly through extended nanocrystallite clusters with weak electron-phonon coupling. The flexibility of the dual-chamber co-deposition process is demonstrated by the synthesis of mixed-phase thin films comprised of two distinct chemical species, such as germanium nanocrystallites embedded in a-Si:H and Si nanocrystallites embedded within an insulating a-SiNx:H film.

In a-Si:H, large concentrations of B or P (of order 1%) are required to dope the material, suggesting that doping mechanisms are very different than for the crystal for which much smaller concentrations are required. In this paper, we report simulations on B and P introduced into realistic models of a-Si:H and a-Si, with concentrations ranging from 1.6% to 12.5% of B or P in the amorphous host. The results indicate that tetrahedral B and P are effective doping configurations in a-Si, but high impurity concentrations introduce many defect states. For a-Si:H, we report that both B(3,1) and P(3,1) (B or P atom bonded with three Si atoms and one H atom) are effective doping configurations. We investigate H passivation in both cases. For both B and P, there exists a “hydrogen poison range” of order 6 Å for which H in a bond-center site can suppress doping. For B doping, nearby H prefers to stay at the bond-center of Si-Si, leaves B four-fold and neutralizes the doping configuration; for P doping, nearby H spoils the doping by inducing a reconstruction rendering initially tetrahedral P three-fold.

We have investigated the reliability of the inverted-staggered etch stopper structure oxide-based TFTs under negative gate bias stress combined with 400 nm wavelength light illumination and the relationship between the carrier concentration at the channel and the extent of Vth shift. It was found that the photo-induced holes cause the severe Vth degradation at the beginning of stress and the hole trapping rate of a single hole is not altered with the increase of the hole concentration. In oxide-based TFTs, the hole concentration at the channel is the determinant factor of the reliability.

Back surface passivation is one of the major challenges in the backside illuminated sensor technology. Ion implantation followed by non-melt pulsed Laser Thermal Annealing (LTA) has been identified as a promising candidate to address this issue. In this work, a shallow B-doped layer is implanted at the backside, further activated using LTA in the non-melt regime. LTA process effectiveness in terms of crystal damage recovery as well as dopant diffusion and activation is studied through room-temperature photoluminescence, Secondary Ion Mass Spectroscopy and four-point probe sheet resistance. These studies demonstrate that non-melt LTA with multiple pulses induces high activation without visible diffusion with an effective curing of the implantation-induced crystalline defects. This is made possible thanks to a submicrosecond process timescale coupled to a reasonable number of shots as shown by thermal simulations and simple diffusion estimations.

In this contribution 1, 2 and 3-dimensional simulations of micromorph silicon solar cells are presented. In order to simulate solar cells with rough interfaces, the surface topographies were measured via atomic force microscopy (AFM) and transferred into the commercial software Sentaurus TCAD (Synopsys). The model of the structure includes layer thicknesses and optoelectronic parameters like complex refractive index and defect structure. Results of the space resolved optical generation rates by using of the optical solver Raytracer are presented. The space resolved optical generation rate inside the semiconductor layers depends on the structure of the transparent conductive oxides (TCO) interface. In this contribution the influence of different optical generation rates on the electrical characteristics of the solar cell device are investigated. Furthermore, the optical and electrical results of the 1D, 2D and 3D structures, which have equal layer thicknesses and optoelectronic parameters, are compared.

Growth process of microcrystalline silicon (μc-Si:H) using plasma-enhanced chemicalvapor- deposition method under high-rate-growth condition has been studied for the control of optoelectronic properties in the resulting materials. We have found two important things for the spatial-defect distribution in the resulting μc-Si:H through a precise dangling-bond-density measurement, e. g., (1) dangling-bond defects are uniformly distributed in the bulk region of μc- Si:H films independent of their crystallite size and (2) large number of dangling bonds are located at the surface of μc-Si:H especially when the film is deposited at high growth rate. Starting procedure of film growth has been investigated as an important process to control the dangling-bond-defect density in the bulk region of resulting μc-Si:H through the change in the electron temperature by the presence of particulates produced at the starting period of the plasma. Deposition of Si-compress thin layer on μc-Si:H grown at high rate followed by thermal annealing has been proposed as an effective method to reduce the defect density at the surface of resulting μc-Si:H. Utilizing the starting-procedure-controlling method and the compress-layerdeposition method together with several interface-controlling methods, we have demonstrated the fabrication of high conversion-efficiency (9.27%) substrate-type (n-i-p) μc-Si:H solar cells whose intrinsic μc-Si:H layer is deposited at high growth rate of 2.3 nm/sec.

In this paper we present results on the use of a multilayered a-SiC:H heterostructure as a device for wavelength-division demultiplexing of optical signals. This device is useful in optical communications applications that use the wavelength division multiplexing technique to encode multiple signals into the same transmission medium. The device is composed of two stacked p-i-n photodiodes, both optimized for the selective collection of photo generated carriers. Band gap engineering was used to adjust the photogeneration and recombination rates profiles of the intrinsic absorber regions of each photodiode to short and long wavelength absorption and carrier collection in the visible spectrum. The photocurrent signal using different input optical channels was analyzed at reverse and forward bias and under steady state illumination. A demux algorithm based on the voltage controlled sensitivity of the device was proposed and tested. The operation frequency of the device was analyzed under different optical bias conditions. An electrical model of the WDM device is presented and supported by the solution of the respective circuit equations.

We apply a thin luminescent downshifting (LDS) coating to a hydrogenated amorphous Si (a-Si:H) solar cell and study the mechanism of possible current enhancement. The conversion material used in this study converts wavelengths below 400 nm to a narrow line around 615 nm. This material is coated on the front of the glass of the a-Si:H solar cell with a glass/TCO/p/i/n/Ag superstrate configuration. The initial efficiency of the solar cell without the LDS coating is above 9.0 % with open circuit voltage of 0.84 V. Typically, the spectral response below 400 nm of an a-Si:H solar cell is weaker than that at 615 nm. By converting ultraviolet (UV) light to red light, the solar cell will receive more red photons; therefore, solar cell performance is expected to improve. We observe evidence of downshifting in reflectance spectra. The cell Jsc decreases by 0.13 mA/cm2, and loss mechanisms are identified.

We synthesized amorphous semiconductor films composed of Mo-encapsulating Si clusters (MoSin : n∼10) on solid substrates. The MoSi10 films had Si networks similar to hydrogenated amorphous Si and an optical gap of 1.5 eV. Electron spin resonance signals were not observed in the films indicating that dangling bonds of Si were terminated by Mo atoms. We fabricated thin-film-transistors using the MoSi10 film as a channel material. The electric field effect of the film was clearly observed. This suggests that the density of mid-gap states in the film is low enough for the field effect to occur.

Hydrogenated amorphous silicon (a-Si:H) multi-junction devices have demonstrated a way to increase the efficiency of a-Si:H thin-film photovoltaic (PV) modules, which is now well above 10%. Since the current–matching behaviour of all sub-cells is a critical aspect, the measurement of the spectral response (SR) of all junctions provides valuable information to optimize the device performance under a given spectral distribution. In this work the authors investigate the impact of low shunt resistances on the SR of a double-junction a-Si:H/μc-Si PV module. The origin of a low shunt resistance in a-Si:H multi-junction devices is revised. A simple theoretical approach is then used to describe the anomalous dark SR observed experimentally as a consequence of the presence of low shunt resistances. The dark SR allows therefore to detect the presence of shunts and discriminate the defective sub-cell.

Polycrystalline silicon thin films were formed from the amorphous silicon thin film by the pulsed rapid thermal annealing process enhanced with a thin nickel seed layer through the vertical crystallization mechanism. In this paper, authors presented the results on the material properties of the crystallized film. The dopant and film thickness effects were also investigated. It has been demonstrated that a 2 μm thick amorphous silicon n+-i-p+ diode structure could be transformed into polycrystalline stack with a 4-pulse 1 sec 850°C heating and 5 sec cooling cycle process.

Green laser crystallization of a-Ge0.85Si0.15 films deposited using Low Pressure Chemical Vapour Deposition is studied. Large grains of 8x2 μm2 size were formed using a location-controlled approach. Characterization is done using Scanning Electron Microscopy, Atomic Force Microscopy, X-Ray Photoelectron Spectroscopy and X-Ray Diffraction.

An amorphous silicon (a-Si:H) thin film transistor (TFT) circuit designed for charging of an energy storage device using a photovoltaic (PV) array is presented. The TFT circuit is fabricated at plastic compatible temperatures (∼150°C) and as such can easily be integrated within a range of platforms including flexible displays. The circuit provides a high degree of output voltage stability over a range of light intensities and device stress.

Chemical annealing is a powerful technique for controlling H bonding and optical absorption in amorphous semiconductors. We have shown previously that the use of careful chemical annealing by Argon can lower the bandgap of a-Si:H while maintaining electronic properties in both films and devices. In this work, we describe new work on chemical annealing of A-(Si,Ge):H films and devices. The technique consists in growing very thin layers (1-3 nm) of A-(Si,Ge) from mixtures of hydrogen, Silane and Germane, and then subjecting this thin layer to ion bombardment by Ar. The cycle is repeated many times to achieve the desired thickness of the intrinsic layer. The resulting film and device were measured for their composition using energy dispersive spectroscopy (EDS) analysis. We discovered that the composition itself, namely the Ge:Si ratio in the film, could be varied by changing the ion bombardment conditions. Lower energy bombardment led to a higher Ge:Si ratio for the same germane/Silane ratio in the gas phase. By controlling ion bombardment during the Ar annealing cycle, we were able to reduce the H content of the film and achieve good electronic properties. It will be shown that by appropriate control over ion energies, one can obtain films and devices which are of good quality and low bandgap as well.

In order to obtain efficient light trapping within a thin-film silicon solar cell, randomly textured interfaces are used. The texture can be introduced by wet-chemical etching in diluted hyrdofluoric acid (HF). By varying of the HF concentration, a continuous transition to smaller surface structures can be achieved. Near-field scanning optical microscopy is applied to measure scattered light with sub-wavelength resolution. On those different surfaces, using Fourier high-pass filters on the measured near-field images, surface features with a high light trapping potential are identified. Finally, criteria for optimized scattering surfaces are obtained.

We present an investigation of the band offsets in amorphous/crystalline silicon heterojunctions (a-Si:H/c-Si) using low energy photoelectron spectroscopy, ellipsometry and surface photovoltage data. For a variation of deposition conditions that lead to changes in hydrogen content and the thereby the a-Si:H band gap by ∼180 meV, we find that mainly the conduction band offset ΔEV varies, while ΔEC stays constant within experimental error. This result can be understood in the framework of charge neutrality (CNL) band lineup theory.

The roles of hydrogen plasma radicals on passivation of several kinds of crystallized poly-Si thin films were investigated using optical emission spectroscopy (OES) combined with Hall mobility, Raman spectra, and absorption coefficient spectra. It was found that different kinds of hydrogen plasma radicals are responsible for passivation of dissimilar poly-Si crystallized by different method. Radicals Hα with lower energy are mainly responsible for passivating the poly-Si crystallized by solid phase crystallization (SPC) whose crystallization precursor was made by plasma enhanced chemical vapor deposition (PECVD). Higher energy radicals H* are more effective in passivating defects left over by Ni in poly-Si crystallized by Metal Induced Crystallization (MIC). The highest energy radicals Hβ and Hγ are needed to passivate the defects in poly-Si crystallized by SPC but whose precursor was made by low pressure CVD (LPCVD).