Photoluminescence (PL) spectroscopy was carried out on a series of Si-doped bulk InGaN films in the low indium (In) composition regime. Room temperature PL showed a factor of 25 increase in integrated intensity as the In composition was increased from 0 to 0.07. Temperature dependent PL data was fit to an Arrhenius equation to reveal an increasing activation energy for thermal quenching of the PL intensity as the In composition is increased. Time resolved PL measurements revealed that only the sample with highest In ( x=0.07) showed a strong spectral variation in decay time across the T=4K PL resonance, indicative of recombination from localized states at low temperatures. The decay times at room temperature were non-radiatively dominated for all films, and the room temperature (non-radiative) decay times increased with increasing In, from 50-230 psec for x=0-0.07. Our data demonstrate that non-radiative recombination is less effective with increasing In composition.

We have grown GaN, with addition of a 0.10 to 0.33 % Al, on sapphire(0001) substrates by solid-source RF-plasma assisted MBE. The Al-concentration was determined by secondary ion-mass spectrometry and Auger-electron spectroscopy, while the layer quality was assessed by photoluminescence and high-resolution scanning electron microscopy. Microscopy revealed a meandering pattern and a surface roughness varying with Al-content. The smallest surface roughness was obtained at 0.10 % Al. Photoluminescence revealed two main peaks attributed to the neutral donor-bound exciton. Its energy increased slightly with Al-concentration, which established a correlation between the Al-concentration and the band gap.

Discrete and coalesced monocrystalline GaN and AlxGa1−xN layers grown via Pendeoepitaxy (PE) [1] originated from side walls of GaN seed structures containing SiNx top masks have been grown via organometallic vapor phase deposition on GaN/AlN/6HSiC(0001) and GaN(0001)/AlN(0001)/3C-SiC(111)/Si(111) substrates. Scanning and transmission electron microscopies were used to evaluate the external microstructures and the distribution of dislocations, respectively. The dislocation densities in the PE grown films was reduced by at least five orders of magnitude relative to the initial GaN seed layers. Tilting in the coalesced GaN epilayers was observed via X-ray diffraction. A tilt of 0.2° was confined to areas of mask overgrowth; however, no tilting was observed in the material suspended above the SiC substrate. The strong, low-temperature PL band-edge peak at 3.45 eV with a FWHM of 17 meV was comparable to that observed in PE GaN films grown on 6H-SiC(0001). The band-edge in the GaN grown on AlN(0001)/SiC(111)Si(111) substrates was shifted to a lower energy by 10 meV, indicative of a greater tensile stress.

We present preliminary results on gallium nitride growth by HVPE on C-plane sapphire with 2, 4 and 6 degrees misorientation towards M and A directions. A nucleation GaN buffer layer is deposited prior the growth by MOVPE. Surface morphology and growth rates are compared with those obtained on exact C-plane oriented sapphire, for various growth conditions. As expected, the steps already present on the substrate surface help to initiate a directed step-flow growth mode. The large hillocks, which are typical for HVPE GaN layers on (0001) sapphire planes, are replaced by more or less parallel macro-steps. The width and height of these steps, due to step bunching effect, depend directly on the angle of misorientation and on the growth conditions, and are clearly visible by optical or scanning electron microscopy. Atomic force microscopy and X-ray diffraction measurements have been carried out to quantify the surface roughness and crystal quality.

Photoluminescence (PL) of modulation-doped Al0.22Ga0.78N/GaN heterostructures was investigated. The PL peak related to recombination between the two-dimensional electron gases (2DEG) and photoexcited holes is located at 3.448 eV at 40 K, which is 45 meV below the free excitons (FE) emission in GaN. The peak can be observed at temperatures as high as 80 K. The intensity of the 2DEG PL peak is enhanced significantly by incorporating a thin Al0.12Ga0.88N layer into the GaN layer near the heterointerface to suppress the diffusion of photoexcited holes. The energy separation of the 2DEG peak and the GaN FE emission decreases with increasing temperature. Meanwhile, the 2DEG peak energy increases with increasing excitation intensity. These results are attributed to the screening effect of electrons on the bending of the conduction band at the heterointerface, which becomes stronger when temperature or excitation intensity is increased.

Optical second and third harmonic generation measurements were carried out on GaN layers grown by metalorganic chemical vapor deposition (MOCVD) on sapphire substrates. The measured d33 is 33 times the d11 of quartz. The angular dependence of second-harmonic intensity as well as the measured ratios d33/d15= -2.02 and d33/d31 = -2.03 confirm the wurzite structure of the studied GaN layers with the optical c-axis oriented perpendicular to the sample surface. Fine oscillations were observed in the measured second and third harmonic angular dependencies. A simple model based on the interference of the fundamental beam in the sample was used to explain these oscillations.

The hardness of single crystal GaN (gallium nitride) at elevated temperature is measured for the first time and compared with other materials. A Vickers indentation method was used to determine the hardness of crack-free GaN samples under an applied load of 0.5N in the temperature range 20 - 1200°C. The hardness is 10.8 GPa at room temperature, which is comparable to that of Si. At elevated temperatures GaN shows higher hardness than Si and GaAs. A high mechanical stability for GaN at high temperature is deduced.

Two-step surface-treatment is introduced to obtain low resistance Pt contacts to ptype GaN. The first step is performed after the mesa etching process using buffered oxide etch (BOE) and ammonium sulfide [(NH4)2Sx]. This is followed by the second step using BOE. The Pt contact, which was treated sequentially using ultrasonically boiled BOE (10 min) and boiled (NH4)2Sx (10 min), produces a specific contact resistance of 3.0 (±3.8)×10-5 Ωcm2. However, the contact, that was simply BOE-treated, yields 3.1 (±1.1)×10-2 Ωcm2. This indicates that the two-step surface treatment is promising technique for obtaining high quality ohmic contacts to p-GaN. Investigation of the electronic transport mechanisms using current-voltage-temperature (I-V-T) data indicates that thermionic field emission is dominant in the surface-treated Pt contacts.

The polarity of laterally epitaxially overgrown (LEO) GaN on Si(111) with an AlN buffer layer grown by MOCVD has been studied by convergent beam electron diffraction (CBED). The LEO GaN was studied by cross-section and plan-view transmission electron microscopy (TEM). The threading dislocation density is less than 108cm−2 and no inversion domains were observed. CBED patterns were obtained at 200 kV for the <1100> zone. Simulation was done by many-beam solution with 33 zero-order beams. The comparison of experimental CBED patterns and simulated patterns indicates that the polarity of GaN on Si(111) is Ga face.

Single quantum well InGaN was grown by molecular beam epitaxy with ammonia as the nitrogen source. The samples were grown on (0001) sapphire substrates. The photoluminescence (PL) intensity of InGaN quantum wells showed band-edge emissions at 2.71eV at low temperature (10 K). PL was investigated as a function of excitation intensity and temperature. The relationship between PL intensity and excitation intensity, as well as the relationship between PL intensity and lattice temperature was studied. Also studied was the combined effect of temperature and intensity variation. Detailed results are reported here.

We have carried out a series of lateral epitaxial overgrowths (LEO) of GaN through thin oxide windows by the hydride vapor phase epitaxy (HVPE) technique at different growth temperatures. High lateral growth rate at 1100°C allows coalescing of neighboring islands into a continuous and flat film, while the lower lateral growth rate at 1050°C produces triangular-shaped ridges over the growth windows. In either case, threading dislocations bend into laterally grown regions to relax the shear stress developed in the film during growth. In regions close to the mask edge, where the shear stress is highest, dislocations interact and multiply into arrays of edge dislocations lying parallel to the growth window. This multiplication and pileup of dislocations cause a large-angle tilting of the laterally grown regions. The tilt angle is high (∼8 degrees) when the growth is at 1050°C and becomes smaller (3-5 degrees) at 1100°C. At the coalescence of growth facets, a tilt-type grain boundary is formed. During the high-temperature lateral growth, the tensile stress in the GaN seed layer and the thermal stress from the mask layer both contribute to a high shear stress at the growth facets. Finite element stress simulations suggest that this shear stress may be sufficient to cause the observed excessive dislocation activities and tilting of LEO regions at high growth temperatures.

We present a comparison between optical properties of two samples grown by hydride vapor phase epitaxy, one directly on Sapphire substrate (non-ELO) and one epitaxial lateral overgrown (ELO) on SiO2 patterned Sapphire substrate. The ELO material shows an improvement of the UV emission and slight decrease of the yellow emission. The band edge emission is red shifted due to the relaxation of the compressive strain. In spite of the increase in the UV emission, the lifetime of the excitons in the ELO material is more than twice lower than non-ELO material. We attribute this to screening effects of the background electron concentration.

The effect of In on the structural and optical properties of InxGa1−xN/GaN multiple quantum wells (MQWs) was investigated. These were five-period MQWs grown on sapphire by metalorganic chemical vapor deposition. Increasing the In composition caused broadening of the high-resolution x-ray diffraction superlattice satellite peak and the photoluminescence-excitation bandedge. This indicates that the higher In content degrades the interface quality because of nonuniform In incorporation into the GaN layer. However, the samples with higher In compositions have lower room temperature (RT) stimulated (SE) threshold densities and lower nonradiative recombination rates. The lower RT SE threshold densities of the higher In samples show that the suppression of nonradiative recombination by In overcomes the drawback of greater interface imperfection.

We report on experiments which unequivocal identify the chemical nature of optical transitions related to As (2.58 eV), Ge (3.398 eV) and Se (1.49 eV) found in the photoluminescence (PL) spectra of GaN. For this purpose epitaxial GaN layers were doped by ion implantation (60 keV, 3×1012 cm−2) with the radioactive isotopes 71As and 72Se. The isotope 71As (half-life 64.28 h) decays first into 71Ge (11.43 d), which finally transmutes into stable 71Ga. The isotope 72Se decays via 72As (26 h) into stable 72Ge. These chemical transmutations were monitored with photoluminescence spectroscopy (PL). The half-lives resulting from exponential fits on our PL data are in excellent agreement with the half-lives of the isotopes. Our experiments clearly show that in each case the luminescence center involves exactly one As, Ge or Se atom. In addition to this, the results imply that no optically active GaN antisite exists.

Although GaN has been grown mainly by metal organic chemical vapour deposition (MOCVD), molecular beam epitaxy (MBE) offers the advantages of lower growth temperatures and a more flexible control over doping elements and their concentrations [1]. We are growing GaN by MBE on sapphire substrates, using a GaN buffer layer to reduce the misfit strain, thus improving the structural quality of the epilayer. The quality of the GaN epilayers (in terms of their photoluminescence, mobility and structure) has been investigated as a function of the buffer layer thickness and annealing time.

The investigation showed that increasing the buffer layer thickness improved the mobility of the material because the defect density in the GaN epilayer decreased. Optical characterisation showed that the ratio of the donor band exciton (DBE) peak (3.47eV) to the structural peak (3.27eV) in the photoluminescence spectrum, measured at 10K, increased with decreasing defect density. The unwanted structural peak can be considered to originate from a shallow donor to a shallow acceptor transition, which is clearly related to the structural defects in GaN. Thus by increasing the buffer layer thickness and annealing time the structural quality, mobility and photoluminescence improves in the GaN epilayers.

Structural characterisation by transmission electron microscopy (TEM) showed that the observed increase in the DBE to structural peak ratio in the photoluminescence spectra could be correlated with a decrease in the density of stacking faults in the GaN epilayers. The detailed structure of these stacking faults was investigated by dark field and high resolution TEM. Their effect on the electrical and optical behaviour of GaN may be assessed by determining the local change in the dielectric function in the vicinity of individual stacking faults.

The behavior of threading dislocations during mass transport of GaN was investigated in detail by transmission electron microscopy. Mass transport occurred at the surface. Therefore, growing species are supplied from the in-plane direction. The behavior of threading dislocations was found to be strongly affected by the mass transport process as well as the high crystallographic anisotropy of the surface energy of the facets particular to GaN.

Microstructural investigations on GaN films grown on SiC and sapphire substrates by laser induced molecular beam epitaxy have been performed. Threading dislocations with Burgers vectors of 1/3<1120>, 1/3<1123> and [0001] are typical line defects, predominantly the first type of dislocations. Their densities are typically 1.5×1010 cm−2 and 4×109 cm−2 on SiC and sapphire, respectively. Additionally, planar defects characterized as inversion domain boundaries lying on {1100} planes have been observed in GaN/sapphire samples with an inversion domain density of 4×109 cm−2. The inversion domains are of Ga-polarity with respect to the N-polarity of the adjacent matrix. However, GaN layers grown on SiC show Ga-polarity. Possible reasons for the different morphologies and structures of the films grown on different substrates are discussed. Based on an analysis of displacement fringes of inversion domains, an atomic model of the IDB-II with Ga-N bonds across the boundary was deduced. High resolution transmission electron microscopy (HRTEM) observations and the corresponding simulations confirmed the IDB-II structure determined by the analysis of displacement fringes.

GaN-based metal-ferroelectric-semiconductor (MFS) structure has been fabricated by using ferroelectric Pb(Zr0.53Ti0.47)O3 (PZT) instead of conventional oxides as gate insulators. The GaN and PZT films in the MFS structures have been characterized by various methods such as photoluminescence (PL), wide-angle X-ray diffraction (XRD) and high-resolution X-ray diffraction (HRXRD). The Electric properties of GaN MFS structure with different oxide thickness have been characterized by high-frequency C-V measurement. When the PZT films are as thick as 1 µm, the GaN active layers can approach inversion under the bias of 15V, which can not be observed in the traditional GaN MOS structures. When the PZT films are about 100 nm, the MFS structures can approach inversion just under 5V. All the marked improvements of C-V behaviors in GaN MFS structures are mainly attributed to the high dielectric constant and large polarization of the ferroelectric gate oxide.

In this paper we illustrate the application of electron beam techniques to the measurement of strain, defect and alloy concentrations in nitride thin films. We present brief comparative studies of CL spectra of AlGaN and InGaN epilayers and EBSD patterns obtained from two silicon-doped 3 μm thick GaN epilayers grown on an on-axis (0001) sapphire substrate and a sapphire substrate misoriented by 10° toward the m-plane (1010).

The presence of oxygen throughout the nominally AlN nucleation layer of a RF assisted MBE grown III-N HEMT was revealed upon examination by Electron Energy Loss Spectroscopy (EELS) in a Scanning Transmission Electron Microscope (STEM). The nucleation layer generates the correct polarity (gallium face) required for producing a piezoelectric induced high mobility two dimensional electron gas at the AlGaN/GaN heterojunction. Only AlN or AlGaN nucleation layers have provided gallium face polarity in RF assisted MBE grown III-N's on sapphire. The sample was grown at Cornell University in a Varian GenII MBE using an EPI Uni-Bulb nitrogen plasma source. The nucleation layer was examined in the Cornell University STEM using Annular Dark Field (ADF) imaging and Parallel Electron Energy Loss Spectroscopy (PEELS). Bright Field TEM reveals a relatively crystallographically sharp interface, while the PEELS reveal a chemically diffuse interface. PEELS of the nitrogen and oxygen K-edges at approximately 5-Angstrom steps across the GaN/AlN/sapphire interfaces reveals the presence of oxygen in the AlN nucleation layer. The gradient suggests that the oxygen has diffused into the nucleation region from the sapphire substrate forming this oxygen containing AlN layer. Based on energy loss near edge structure (ELNES), oxygen is in octahedral interstitial sites in the AlN and Al is both tetrahedrally and octahedrally coordinated in the oxygen rich region of the AlN.