Symposium O – Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics
Back matter (Indexes)
OPL volume 1335 Author and Subject Indexes
- Published online by Cambridge University Press: 25 October 2011, pp. 125-127
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Research Article
Defects in Low-k Insulators (κ=2.5 – 2.0): ESR Analysis and Charge Injection
- Published online by Cambridge University Press: 18 August 2011, mrss11-1335-o04-04
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Ozone Treatment on Nanoporous Ultralow Dielectric Materials to Optimize their Mechanical and Dielectrical Properties
- Published online by Cambridge University Press: 10 August 2011, mrss11-1335-o09-16
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Microbump Impact on Reliability and Performance in Through-Silicon Via Stacks
- Published online by Cambridge University Press: 10 August 2011, mrss11-1335-o08-05
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Effect of Chemical Solutions and Surface Wettability on the Stability of Advanced Porous Low-k Materials
- Published online by Cambridge University Press: 02 August 2011, mrss11-1335-o03-02
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Optimizing Stressor Film Deposition Sequence in Polish Rate Order for Best Planarization
- Published online by Cambridge University Press: 23 June 2011, mrss11-1335-o03-01
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Optical Interconnect Technologies based on Silicon Photonics
- Published online by Cambridge University Press: 10 August 2011, mrss11-1335-o10-01
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Patterning Organic Fluorescent Molecules with SAM Patterns
- Published online by Cambridge University Press: 23 June 2011, mrss11-1335-o09-08
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Evaluation of Ultra-thin Layer Fabricated by Wet-process as a Pore-Seal for Porous Low-k Films
- Published online by Cambridge University Press: 29 July 2011, mrss11-1335-o02-04
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32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed
- Published online by Cambridge University Press: 10 August 2011, mrss11-1335-o06-02
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Development of Electrochemical Copper Deposition Screening Methodologies for Next Generation Additive Selection
- Published online by Cambridge University Press: 10 August 2011, mrss11-1335-o09-27
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Amorphous Ta-N as a Diffusion Barrier for Cu Metallization
- Published online by Cambridge University Press: 27 July 2011, mrss11-1335-o06-03
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New designs of hydrophobic and mesostructured Ultra Low k materials with isolated mesopores
- Published online by Cambridge University Press: 22 June 2011, mrss11-1335-o01-04
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Comparison of TiN thin films grown on SiO2 by reactive dc magnetron sputtering and high power impulse magnetron sputtering
- Published online by Cambridge University Press: 10 August 2011, mrss11-1335-o07-07
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Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics
- Published online by Cambridge University Press: 10 August 2011, mrss11-1335-o08-09
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A Less Damaging Patterning Regime for a Successful Integration of Ultra Low-k Materials in Modern Nanoelectronic Devices
- Published online by Cambridge University Press: 03 August 2011, mrss11-1335-o04-02
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Specific contact resistance of ohmic contacts to n-type SiC membranes
- Published online by Cambridge University Press: 27 July 2011, mrss11-1335-o09-01
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Ultra Low-k Materials Based on Self-Assembled Organic Polymers
- Published online by Cambridge University Press: 29 July 2011, mrss11-1335-o01-02
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Front Cover (OFC, IFC) and matter
OPL volume 1335 Cover and Front matter
- Published online by Cambridge University Press: 20 February 2017, pp. f1-f9
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