Research Article
Reliability of Electroless Processed Thin Layered Solder Joints
- Published online by Cambridge University Press: 10 February 2011, 3
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Strain Measurements in a Thermally-Cycled Flip-Chip PBGA Solderball
- Published online by Cambridge University Press: 10 February 2011, 9
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Fracture of a Lead-Tin and a Tin-Silver Solder Under Combined Tensile Shear Loading
- Published online by Cambridge University Press: 10 February 2011, 15
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Effect of a Titanium Interlayer on the Performance of the Titanium Nitride Diffusion Barrier
- Published online by Cambridge University Press: 10 February 2011, 21
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Kinetics of the Tial3 Formation From Al/Ti Thin Films
- Published online by Cambridge University Press: 10 February 2011, 27
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TiB2as a Diffusion Barrier for Cu/<si> Metallization
- Published online by Cambridge University Press: 10 February 2011, 33
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Diffusion Barrier Characteristics of Zirconium Diboride Films Grown by Remote Plasma CVD
- Published online by Cambridge University Press: 10 February 2011, 39
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Characteristics of Molybdenum Nitride Thin Film by N2 + Ion Implantation
- Published online by Cambridge University Press: 10 February 2011, 45
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Homogeneous Ultrathin Diffusion Barriers Deposited on Low Dielectric Constant Polymers
- Published online by Cambridge University Press: 10 February 2011, 51
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Interconnect Failure Mechanism Maps for Different Metallization Materials and Processes
- Published online by Cambridge University Press: 10 February 2011, 59
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Simulation of Electromigration Induced Atomic Transport in Al-Cu Alloys
- Published online by Cambridge University Press: 10 February 2011, 65
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Immortal InterConnects—Prevent Cracking and Limit Void Size
- Published online by Cambridge University Press: 10 February 2011, 71
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Effects of Preexisting Stress Voids on Electromigration Stress Buildup and Flux Divergence
- Published online by Cambridge University Press: 10 February 2011, 77
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Interconnect Reliability Study Using a Microscopic Nucleation Model for Electromigration
- Published online by Cambridge University Press: 10 February 2011, 83
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Effect of Cu on Al Interfacial Mass Transport in Bamboo Rie and Damascene Al(Cu)
- Published online by Cambridge University Press: 10 February 2011, 91
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Electromigration Voiding in Argon-Implanted Interconnects
- Published online by Cambridge University Press: 10 February 2011, 97
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A Detailed Study of Void Motion In Passivated Aluminum Interconnects
- Published online by Cambridge University Press: 10 February 2011, 103
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In-Situ Electromigration Damage of Al Interconnect Lines and the Influence of Grain Orientation
- Published online by Cambridge University Press: 10 February 2011, 109
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Electromigration in Sputter Deposited Copper/Zirconium Alloys
- Published online by Cambridge University Press: 10 February 2011, 115
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Cause of the Decrease in Electromigration Resistance in Am/Al3Ti Lines
- Published online by Cambridge University Press: 10 February 2011, 121
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