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Strain Measurements in a Thermally-Cycled Flip-Chip PBGA Solderball

Published online by Cambridge University Press:  10 February 2011

E. S. Drexler
E. S. Drexler*
Affiliation:
Materials Reliability Division, NIST, Boulder, Colorado 80303, drexler@boulder.nist.gov
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Abstract

The mismatch between the coefficients of thermal expansion of silicon chips and their organic substrates has been mitigated through the practice of using underfill in flip-chip packages. Yet solder fatigue and package failures still occur. This is particularly true for flip-chips on organic substrates that are thermally cycled between low (−55 °C) and high temperatures (125 °C). In this study, I used electron-beam moir6 to measure displacements and calculate strains in a solderball contained in a flip-chip plastic-ball grid array package. A crossed-line grating with a pitch of 450 nm was used to allow detailed measurements of the local displacements from a cross section of a flip-chip package. Elastic displacements were observed and measured, and the v-field displacements, out of the plane of the chip, were more significant than the shear or u-field, in the plane of the chip, displacements. Larger v-field displacements were measured near the center of the silicon chip than at the edge of the chip.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 563: Symposium M – Materials Reliability in Microelectronics IX , 1999 , 9
Copyright
Copyright © Materials Research Society 1999

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