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Fracture of a Lead-Tin and a Tin-Silver Solder Under Combined Tensile Shear Loading

  • M. Manoharan (a1) and K. S. Siow (a1)

Abstract

The increasing demands on solder joints have made it imperative that they perform not only their traditional role of electrical connection but also possess good mechanical integrity. One such key mechanical property is the shear strength of the solder. A number of specimen geometries can be used to evaluate the shear strength of solders, each with its advantages and limitations. However, these geometries do not provide information about the notched fracture strength of the solder under shear. Studies on a number of ductile materials have indicated that in many of these materials shear is the preferential mode of fracture even when the imposed load is a combination of tensile and shear. This study, which is part of a larger project on the failure of materials under combined tensile-shear loading, uses a modified compact tension specimen to measure the appropriate failure criterion. It is shown that the fracture of solders under these conditions follows the general principles of a mixedmode fracture mechanism map and shear is the preferred mode of failure.

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1. Freer, J.L. and Morris, J.W. Jr, J. Electronic Mater., 6, p. 647, (1992).
2. Miglin, M. T., Hirth, J.P. and Rosenfield, A.R., Res. Mechanica, 11, p. 85 (1984).
3. Schroth, J.G., Hirth, J.P., Hoagland, R.G., Scr. Metall., 19, p. 215, (1985).
4. Schroth, J.G., Hirth, J.P., Hoagland, R.G. and Rosenfield, A.R., Metall. Trans., 18A, p. 1061, (1987).
5. Manoharan, M., Hirth, J.P. and Rosenfield, A.R., Scr. Metall., 23, p. 763, (1989).
6. Kamat, S.V., Hirth, J.P. and Mehrabian, R., Scr. Metall., 23, p. 523, (1989).
7. Manoharan, M., Raghavachary, S., Hirth, J.P. and Rosenfield, A.R., J. Engr. Mater. Tech., 111, p.440, (1989).
8. Raghavachary, S., Rosenfield, A.R. and Hirth, J.P., Metall. Trans., 21A, p. 2539, (1990).
9. Manoharan, M., Hirth, J.P. and Rosenfield, A.R., Acta Metall. Mater., 39, p. 1203, (1991).
10. Manoharan, M., Hirth, J.P. and Rosenfield, A.R., J. Test. Eval., 18, p. 106, (1990).
11. Manoharan, M., Scr. Metall. Mater., 26, p. 1187, (1992).
12. Manoharan, M. and Kamat, S.V., Int. J. Fract., 73, p. R41, (1995).
13. Siow, K.S., Masters Thesis, School of Applied Science, Nanyang Technological University, Singapore, in preparation.

Fracture of a Lead-Tin and a Tin-Silver Solder Under Combined Tensile Shear Loading

  • M. Manoharan (a1) and K. S. Siow (a1)

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