Skip to main content Accessibility help
×
Home

A Detailed Study of Void Motion In Passivated Aluminum Interconnects

  • Jonathan C. Doan (a1), John C. Bravman (a1), Paul A. Flinn (a1) and Thomas N. Marieb (a2)

Abstract

Void motion can be an important part of electromigration failure in interconnects. Investigating this process is difficult due to the large variation in behavior in identical samples tested under identical conditions. To deal with the large variability, we have tested 50 samples to failure at four different accelerated test conditions. Because our automated, in-situ technique images an entire test structure, the complete history of a test line is recorded. By testing many samples under direct observation, the complex motion of electromigration voids was comprehensively studied.

Copyright

References

Hide All
1 I Blech, A. and Meieran, E. S., IEEE Reliab. Maint. Symp., 243248 (1970)
2 Levine, E. and Kitcher, J., Proc. 22nd IEEE IRPS, 242249 (1984).
3 Besser, P. R., Madden, M. C.. and Flinn, P. A., J. Appl. Phys. 72, 37923797 (1992).
4 Kraft, O. Bader, S., Sanchez, J. E., Jr., and Arzt, E., Mater Res Soc. Symp. Proc. 308, 199204 (1993).
5 Marieb, T, Bravman, J. C., Flinn, P.. and Madden, M., Mater. Soc. Symp. Proc. 338, 409–143 (1994)
6 Shatzkes, M. and Llyod, J. R., J. Appl. Phys. 59, 38903893 (1986)
7 Kraft, O. and Arzt, E., Appl. Phys.Lett. 66, 20632065 (1995).
8 Gleixner, R. J., Clemens, B. M.. and Nix, W. D., J. Mater. Res 12,20812090 (1997)
9 Riege, S. P., Hunt, A. W.. and Prybyla, J. A., Mater. Res. Soc. Symp. Proc. 391, 249258 (1995).
10 Arzt, E., Kraft, O., Nix, W. D.. and Sanchez, J. E., Jr., J. Appl. Phys. 76, 15631571 (1994).
11 Marieb, T., Flinn, P., Bravman, J. C., Gardner, D.. and Madden, M., J. Appl. Phys. 78, 10261032 (1995).
12 Riege, S. P., Prybyla, J. A.. and Hunt, A. W., Appl. Phys. Lett. 69, 23672369 (1996).
13 Prybyla, J. A., Riege, S. P., Grabowski, S. P.. and Hunt, A. W., Appl. Phys. Lett. 73, 10831085 (1998).
14 Børgesen, P., Korhonen, M. A., Brown, D. D.. and Li, C. Y., AlP Conf. Proc. 263, 219235 (1992).
15 Madden, M. C., Abratowski, E. V., Marieb, T. N.. and Flinn, P. A., Mater. Res. Soc. Symp. Proc. 265, 3338 (1992).
16 Flinn, P. A., Lee, S, Doan, J. Marieb, T. N., Bravman, J. C.. and Madden, M., AIP Conf. Proc 418,250261 (1997).
17 Marieb, T. N., Thesis, Stanford University, 1994.
18 Blech, I. A., J. Appl. Phys. 47, 12031209 (1976).
19 Lee, S., Doan, J., Bravman, J. C., Flinn, P. A., Marieb, T. N.. and Ogawa, S., AIP Conf. Proc. 418, 101106 (1997).
20 Brown, D. D., Sanchez, J. E., Jr., Korhonen, M. A.. and Li, C.-Y., Appl. Phys. Lett. 67, 439441 (1995).
21 Knowlton, B. D., Clement, J. J., Frank, R. I.. and Thompson, C. V., Mater. Res. Soc. Symp. Proc. 391,189196 (1995).

A Detailed Study of Void Motion In Passivated Aluminum Interconnects

  • Jonathan C. Doan (a1), John C. Bravman (a1), Paul A. Flinn (a1) and Thomas N. Marieb (a2)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed