Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
Research Article
Height Dependent Resistivity of Copper Interconnects in the Size Effect
- Published online by Cambridge University Press: 01 February 2011, 0990-B09-08
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Texture Evolution and Stress in Silver Thin Films on Different Substrates Using X-ray Diffraction
- Published online by Cambridge University Press: 01 February 2011, 0990-B08-07
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Smooth Ag Film Deposited Using e-beam Evaporated Ge as an Intermediate Layer for Applications in Nanoscale Devices and Optical Superlens
- Published online by Cambridge University Press: 01 February 2011, 0990-B08-18
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Enhanced [111] Preferred Orientation of Ag Thin Film on Amorphous SiO2 by Cu Addition
- Published online by Cambridge University Press: 01 February 2011, 0990-B08-06
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Penetration of Tagged Organics into Caulked and Un-caulked Porous Dielectrics Measured by Rutherford Backscattering
- Published online by Cambridge University Press: 01 February 2011, 0990-B03-02
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Charging and Aging Effects in Porous ULK Dielectrics
- Published online by Cambridge University Press: 01 February 2011, 0990-B06-03
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Electrochemical Corrosion Inhibition System for Photoresist Stripper for New Copper FPD Manufacturing
- Published online by Cambridge University Press: 01 February 2011, 0990-B08-26
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Dielectrophoresis-Based Assembly and High-Frequency Characterization of Carbon Nanotube Bundles
- Published online by Cambridge University Press: 01 February 2011, 0990-B04-01
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Fatigue of Damascene Copper Lines under AC Loading
- Published online by Cambridge University Press: 01 February 2011, 0990-B07-17
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Effect of CH4 Plasma Treatment on O2 Plasma Ashed Organosilicate Low-k Dielectrics
- Published online by Cambridge University Press: 01 February 2011, 0990-B03-12
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Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films
- Published online by Cambridge University Press: 01 February 2011, 0990-B06-04
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Chemical Routes to Ultra Thin Films for Copper Barriers and Liners
- Published online by Cambridge University Press: 01 February 2011, 0990-B09-01
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Wafer Level Chip Size Packaging Technology for Bulk Acoustic Wave Filters
- Published online by Cambridge University Press: 01 February 2011, 0990-B07-14
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Low Temperature CVD of Ru from C6H8Ru(CO)3
- Published online by Cambridge University Press: 01 February 2011, 0990-B09-06
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Porosity and its Effect on Barrier Performance of Thin Electroless Cobalt Alloy Caps
- Published online by Cambridge University Press: 01 February 2011, 0990-B08-15
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Characterization of Atomic Layer Deposited Ultrathin HfO2 Film as a Diffusion Barrier in Cu Metallization
- Published online by Cambridge University Press: 01 February 2011, 0990-B09-03
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Nano-scale Conductive Films for High Performance Fine Pitch Interconnect
- Published online by Cambridge University Press: 01 February 2011, 0990-B05-05
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NanoCT: Visualizing of internal 3D-Structures with Submicrometer Resolution
- Published online by Cambridge University Press: 01 February 2011, 0990-B05-09
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Laser-Induced Microstructural Modification of Polycrystalline Cu and Ag Films Encapsulated in SiO2
- Published online by Cambridge University Press: 01 February 2011, 0990-B09-07
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A Study of Tungsten-Titanium Barriers in Silver Metallization
- Published online by Cambridge University Press: 01 February 2011, 0990-B08-10
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