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Wafer Level Chip Size Packaging Technology for Bulk Acoustic Wave Filters

  • Hajime Yamada (a1), Naoko Aizawa (a2), Hiroyuki Fujino (a3), Yoshihiro Koshido (a4) and Yukio Yoshino (a5)...

Abstract

Wafer level chip size packages (WL-CSP) have been successfully fabricated for bulk acoustic wave (BAW) filters. WL-CSP has been completed at the wafer level prior to dicing. Two silicon wafers are used as a die and a lid for chip size packaging. Both device and lid wafers have the same expansion coefficient and the package is strong enough to withstand the thermal stress. The package has a hermetic seal with copper-tin intermetallic bonding. The bonded wafers are then thinned by grinding. Via holes are formed by reactive ion etching (RIE) and filled by copper electroplating. The package has solder bumps on each terminal, ready for flip-chip assembly. We have succeeded to produce CSP-BAW filters with a hermetically sealed cavity, which is 840 micrometers squared and 280 micrometers in height including solder bumps.

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1 Punch, M., Andrieu, B., Popin, L., Launay, N., Arnal, N., Godinat, P., Gruffat, JM., “Latest Development in DRIE for integration of passive components and Wafer-Level Packaging.”, Adixen Technical publication (2004).
2 Goetz, M. and Jones, C., “Chip-scale packaging techniques for RF SAW devices”, SEMI/IEEE Int’l Elect. Manuf. Tech. Symp., 27, 63 (2002).
3 Suzuki, N., Kinzoku Data book (in Japanese), 530, (1993).

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Wafer Level Chip Size Packaging Technology for Bulk Acoustic Wave Filters

  • Hajime Yamada (a1), Naoko Aizawa (a2), Hiroyuki Fujino (a3), Yoshihiro Koshido (a4) and Yukio Yoshino (a5)...

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