21 results
Diffusion of Cu and interfacial reactions during reflow of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga alloy on Ni/Cu substrate
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- Journal of Materials Research / Volume 27 / Issue 8 / 28 April 2012
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- 14 March 2012, pp. 1142-1148
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- 28 April 2012
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Orientation transformation of Pb grains in 5Sn–95Pb/ 63Sn–37Pb composite flip-chip solder joints during electromigration test
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- Journal of Materials Research / Volume 23 / Issue 7 / July 2008
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- 31 January 2011, pp. 1877-1881
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- July 2008
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Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn–9Zn/Cu sandwich
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- Journal of Materials Research / Volume 23 / Issue 4 / April 2008
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- 31 January 2011, pp. 1087-1094
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- April 2008
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Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
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- Journal of Materials Research / Volume 23 / Issue 1 / January 2008
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- 31 January 2011, pp. 264-273
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- January 2008
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Electrochemical corrosion study of Sn–XAg–0.5Cu alloys in 3.5% NaCl solution
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- Journal of Materials Research / Volume 22 / Issue 9 / September 2007
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- 31 January 2011, pp. 2573-2581
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- September 2007
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Microstructure evolution during electromigration between Sn–9Zn solder and Cu
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- Journal of Materials Research / Volume 22 / Issue 5 / May 2007
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- 03 March 2011, pp. 1240-1249
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- May 2007
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Electrical resistance of Sn–Ag–Cu ball grid array packages with Sn–Zn–Bi addition jointed at 240 °C
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- Journal of Materials Research / Volume 22 / Issue 1 / January 2007
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- 03 March 2011, pp. 113-123
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- January 2007
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Effect of microstructural evolution on electrical property of the Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste
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- Journal of Materials Research / Volume 20 / Issue 10 / October 2005
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- 03 March 2011, pp. 2854-2865
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- October 2005
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Damages and Microstructural Variation of High-lead and Eutectic SnPb Composite Flip Chip Solder Bumps Induced by Electromigration
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- Journal of Materials Research / Volume 20 / Issue 8 / August 2005
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- 01 August 2005, pp. 2184-2193
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- August 2005
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Early stage soldering reaction and interfacial microstructure formed between molten Sn–Zn–Ag solder and Cu substrate
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- Journal of Materials Research / Volume 20 / Issue 5 / May 2005
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- 03 March 2011, pp. 1242-1249
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- May 2005
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Early dissolution behavior of copper in a molten Sn–Zn–Ag solder
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- Journal of Materials Research / Volume 20 / Issue 3 / March 2005
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- 01 March 2005, pp. 666-671
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- March 2005
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Interfacial Bonding Behavior with Introduction of Sn–Zn–Bi Paste to Sn–Ag–Cu Ball Grid Array Package During Multiple Reflows
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- Journal of Materials Research / Volume 20 / Issue 1 / January 2005
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- 03 March 2011, pp. 219-229
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- January 2005
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Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C
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- Journal of Materials Research / Volume 19 / Issue 12 / December 2004
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- 01 December 2004, pp. 3560-3568
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- December 2004
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Double peritectic behavior of Ag–Zn intermetallics in Sn–Zn–Ag solder alloys
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- Journal of Materials Research / Volume 19 / Issue 9 / September 2004
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- 03 March 2011, pp. 2719-2724
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- September 2004
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Failure behavior upon shear test of 5Sn–95Pb solder bump after high temperature reliability test
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- Journal of Materials Research / Volume 19 / Issue 8 / August 2004
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- 03 March 2011, pp. 2471-2477
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- August 2004
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Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys
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- Journal of Materials Research / Volume 18 / Issue 9 / September 2003
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- 31 January 2011, pp. 2060-2067
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- September 2003
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Effect of internal stress on elemental diffusion and crystallization of electroless Ni–Cu–P deposit on Al
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- Journal of Materials Research / Volume 18 / Issue 9 / September 2003
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- 31 January 2011, pp. 2221-2227
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- September 2003
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Electrodeposition of eutectic Sn–Zn alloy by pulse plating
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- Journal of Materials Research / Volume 18 / Issue 9 / September 2003
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- 31 January 2011, pp. 2203-2207
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- September 2003
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Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C
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- Journal of Materials Research / Volume 18 / Issue 8 / August 2003
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- 31 January 2011, pp. 1795-1803
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- August 2003
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Microstructures and mechanical properties of Sn–8.55Zn–0.45Al–XAg solders
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- Journal of Materials Research / Volume 18 / Issue 7 / July 2003
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- 31 January 2011, pp. 1528-1534
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- July 2003
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