Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Guaus, E.
and
Torrent-Burgués, J.
2005.
Tin–zinc electrodeposition from sulphate–tartrate baths.
Journal of Electroanalytical Chemistry,
Vol. 575,
Issue. 2,
p.
301.
Anusionwu, B.C.
and
Ilo-Okeke, E.O.
2005.
Temperature effect on demixing and surface properties of Sn–Zn liquid alloys.
Journal of Alloys and Compounds,
Vol. 397,
Issue. 1-2,
p.
79.
Neveu, B.
Lallemand, F.
Poupon, G.
and
Mekhalif, Z.
2006.
Electrodeposition of Pb-free Sn alloys in pulsed current.
Applied Surface Science,
Vol. 252,
Issue. 10,
p.
3561.
Mohanty, Udit Surya
and
Lin, Kwang-Lung
2007.
Electrochemical corrosion study of Sn–XAg–0.5Cu alloys in 3.5% NaCl solution.
Journal of Materials Research,
Vol. 22,
Issue. 9,
p.
2573.
Hansal, W. E. G.
Halmdienst, M.
Hansal, S.
Boussaboua, I.
and
Darchen, A.
2008.
Influence of pulse plating parameters on morphology and hardness of pure tin deposit.
Transactions of the IMF,
Vol. 86,
Issue. 2,
p.
115.
Qin, Yi
Wilcox, G.D.
and
Liu, Changqing
2010.
Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection.
Electrochimica Acta,
Vol. 56,
Issue. 1,
p.
183.
Vicenzo, A.
Bonelli, S.
and
Cavallotti, P. L.
2010.
Pulse plating of matt tin: effect on properties.
Transactions of the IMF,
Vol. 88,
Issue. 5,
p.
248.
Wang, Yi Ta
Ho, Chung Jen
and
Tsai, Hsien Lung
2010.
Effect of In Addition on Wetting Properties of Sn-Zn-In/Cu Soldering.
MATERIALS TRANSACTIONS,
Vol. 51,
Issue. 10,
p.
1735.
Fashu, S.
Gu, C. D.
Zhang, J. L.
Bai, W. Q.
Wang, X. L.
and
Tu, J. P.
2015.
Electrodeposition and characterization of Zn-Sn alloy coatings from a deep eutectic solvent based on choline chloride for corrosion protection.
Surface and Interface Analysis,
Vol. 47,
Issue. 3,
p.
403.
Patil, Mahesh
Singh, Varinder
Simhachalam, Bade
and
Srinivas, Krishna
2020.
Effect of lubrication technique in tube drawing.
Materials Today: Proceedings,
Vol. 28,
Issue. ,
p.
426.
Saitou, M.
and
Oi, T.
2021.
Eutectic Structure of Sn–Zn Thin Films Formed during Electrodeposition.
International Journal of Electrochemical Science,
Vol. 16,
Issue. 3,
p.
210366.
Krajaisri, Pattraporn
Puranasiri, Rachakorn
Chiyasak, Pongpak
and
Rodchanarowan, Aphichart
2022.
Investigation of pulse current densities and temperatures on electrodeposition of tin-copper alloys.
Surface and Coatings Technology,
Vol. 435,
Issue. ,
p.
128244.
De Vos, Mélanie
Zimmer, Alexandre
Toledo, Milan
Ghanbaja, Jaafar
Haye, Emile
Pernot, Gilles
Lacroix, David
and
Stein, Nicolas
2023.
Tuning the physico-chemical properties of SnSe films by pulse electrodeposition.
Applied Surface Science,
Vol. 621,
Issue. ,
p.
156845.
Huang, Jiacheng
Wang, Wenchang
Xiang, Qian
Qin, Shuiping
Wang, Pengju
Mitsuzaki, Naotoshi
and
Chen, Zhidong
2023.
Effect of deposition potential on electrodeposition of Sn-Ag-Cu ternary alloy solderable coating in deep eutectic solvent.
Journal of Electroanalytical Chemistry,
Vol. 943,
Issue. ,
p.
117613.