Detailed understanding of growth termination in vertically aligned single-walled carbon nanotubes (SWNTs) made via supergrowth, or water-assisted growth, remains critical to achieving the ultralong SWNTs necessary for next-generation applications. We describe the irreversible catalyst morphology evolution that occurs during growth, and which limits the lifetime of surface supported catalysts. Growth termination is strongly dependent on growth temperature, but not sensitive to C2H2:H2O ratio. In addition to both planar Ostwald ripening of small (sub-5 nm) Fe catalyst particles and diffusion of metal atoms into the alumina support, other features that contribute to growth termination or deceleration are described, including center-of-mass particle motions and coalescence of smaller species of surface supported Fe nanoparticles. Additionally, a temperature-induced structural transition in the alumina catalyst support is found to be coincident with abrupt growth termination at temperatures of 800 °C and higher. In situ electron microscopy observations are used to directly support these observations.

Polymer electrolyte fuel cells (PEFCs) are drawing attention as energy conversion devices for next generations because of their highly efficient, environmentally benign, and portable features. In the last five decades, three distinguishable innovations were achieved in terms of proton conductive membranes and electrodes: introduction of perfluorinated membranes into PEFCs, adoption of ionomers for electrodes, and increased toughness of membranes by reinforced membranes. The efficiency, cost, and durability achieved from the past three innovations are still not enough to replace competing technologies such as combustion engines. In this review, the authors would elucidate the three different methods based on nanotechnology to overcome the limits: nanoporous carbon-supported catalysts, nanocomposite membranes, and nanostructured membrane electrode assemblies, which will bring the fourth innovation to PEFCs. With the innovation, PEFCs will fulfill the goals of being clean-energy conversion devices in the major applications of stationary, portable, and vehicle markets.

Electroplastic manufacturing processing (EPMP) is a relatively new metal-forming process that is energy efficient, environmentally friendly, and versatile. In particular, it can be used to manufacture metals or alloys that are difficult to process by conventional manufacturing protocols. There have been significant advances in EPMP in the past decade, and this review summarizes our current state of understanding and describes recent developments in EPMP. Particular emphasis is placed on describing the mechanisms responsible for the electroplastic effect and microstructure evolution as well as major advances in EPMP of metals. Challenges facing theoretical and experimental investigations are also discussed.

3D spatially-resolved polychromatic microdiffraction was used to nondestructively obtain depth-dependent elastic strain gradients and dislocation densities in the constituent phases of a directionally solidified NiAl–Mo eutectic composite consisting of ∼500–800 nm Mo fibers in a NiAl matrix. Measurements were made before and after the composite was compressed by 5% and 11%. The Mo fibers were analyzed both in their embedded state and after the matrix was etched to expose them as pillars. In the as-grown composite, due to differential thermal contraction during cooldown, the Mo phase is under compression and the NiAl phase is in tension. After the prestrains, the situation is reversed with the Mo phase in tension and NiAl matrix in compression. This result can be explained by taking into account the mismatch in yield strains of the constituent phases and the elastic constraints during unloading. The dislocation density in both the Mo and NiAl phases is found to increase after prestraining. Within experimental uncertainty there is little discernible difference in the total dislocation densities in the Mo phase of the 5% and 11% prestrained specimens. However, the density of the geometrically necessary dislocations and the deviatoric strain gradients increase with increasing prestrain in both the Mo and NiAl phases.

A new method to accurately and reliably extract the actual Young's modulus of a thin film on a substrate by indentation was developed. The method involved modifying the discontinuous elastic interface transfer model to account for substrate effects that were found to influence behavior a few nanometers into a film several hundred nanometers thick. The method was shown to work exceptionally well for all 25 different combinations of five films on five substrates that encompassed a wide range of compliant films on stiff substrates to stiff films on compliant substrates. A predictive formula was determined that enables the film modulus to be calculated as long as one knows the film thickness, substrate modulus, and bulk Poisson's ratio of the film and the substrate. The calculated values of the film modulus were verified with prior results that used the membrane deflection experiment and resonance-based methods. The greatest advantages of the method are that the standard Oliver and Pharr analysis can be used, and that it does not require the continuous stiffness method, enabling any indenter to be used. The film modulus then can be accurately determined by simply averaging a handful of indents on a film/substrate composite.

This study reports the generation of periodic parallel silicone strips by simply peeling a silicone sheet, oxidized by UV/ozone, from its bonded substrate. This spontaneous formation of strips is initiated by a mixed mode of separation along the peeling direction and subsequent channeling of initiated cracks. The periodicity of the strips is tuned by the bending strain acting on the silicone sheet during peeling, and the regularity and the locus of failure are determined by the extent of oxidization.

Finite element analysis is used to simulate cone indentation creep in materials across a wide range of hardness, strain rate sensitivity, and work-hardening exponent. Modeling reveals that the commonly held assumption of the hardness strain rate sensitivity (mH) equaling the flow stress strain rate sensitivity (mσ) is violated except in low hardness/modulus materials. Another commonly held assumption is that for self-similar indenters the indent area increases in proportion to the (depth)2 during creep. This assumption is also violated. Both violations are readily explained by noting that the proportionality “constants” relating (i) hardness to flow stress and (ii) area to (depth)2 are, in reality, functions of hardness/modulus ratio, which changes during creep. Experiments on silicon, fused silica, bulk metallic glass, and poly methyl methacrylate verify the breakdown of the area-(depth)2 relation, consistent with the theory. A method is provided for estimating area from depth during creep.

Low-load nanoindentation can be used to assess not only the plastic yield point, but the distribution of yield points in a material. This paper reviews measurements of the so-called nanoscale strength distribution (NSD) on two classes of materials: crystals and metallic glasses. In each case, the yield point has a significant spread (10–50% of the mean normalized stress), but the origins of the distribution are shown to be very different in the two materials classes. In crystalline materials the NSD can arise from thermal fluctuations and is attended by significant rate and temperature dependence. In metallic glasses well below their glass-transition temperature, the NSD is reflective of fluctuations in the sampled structure and is not very sensitive to rate or temperature. Computer simulations using shear transformation zone dynamics are used to separate the effects of thermal and structural fluctuations in metallic glasses, and support the latter as dominating the NSD of those materials at low temperatures. Finally, the role of the NSD as a window on structural changes due to annealing or prior deformation is discussed as a direction for future research on metallic glasses in particular.

In a lithium-ion battery, both electrodes are atomic frameworks that host mobile lithium ions. When the battery is being charged or discharged, lithium ions diffuse from one electrode to the other. Such an insertion reaction deforms the electrodes and may cause the electrodes to crack. This paper uses fracture mechanics to determine the critical conditions to avert insertion-induced cracking. The method is applied to cracks induced by the mismatch between phases in LiFePO4.

Molecular dynamics simulations are used to evaluate the influence of Sb dopant atoms at the grain boundaries on plastic deformation of nanocrystalline Cu. Deformation is conducted under uniaxial tensile loading, and Sb atoms are incorporated as substitutional defects at the grain boundaries. The presence of randomly dispersed Sb atoms at the grain boundaries does not appreciably influence the mechanisms associated with dislocation nucleation in nanocrystalline Cu; grain boundary ledges and triple junctions still dominate as partial dislocation sources. However, the magnitude of the tensile stress associated with the partial dislocation nucleation event does increase with increasing Sb concentration and also with increasing grain size. The flow stress of nanocrystalline Cu increases with increasing Sb concentration up to 1.0 at.% Sb, with a maximum observed at a grain size of 15 nm for all Sb concentrations (0.0–2.0 at.% Sb).

An n-body potential is first constructed for the Zr–Al system and proven to be realistic by reproducing a number of important properties of the system. Applying the constructed potential, molecular dynamics simulations, chemical short-range order (CSRO) calculation, and Honeycutt and Anderson (HA) pair analysis are carried out to study the Zr–Al metallic glasses. It is found that for the binary Zr–Al system, metallic glasses are energetically favored to be formed within composition range of 35–75 at.% Al. The calculation shows that the CSRO parameter is negative and could be up to −0.17, remarkably indicating that there exists a chemical short-range order in the Zr–Al metallic glasses. The HA pair analysis also reveals that there are diverse short-range packing units in the Zr–Al metallic glasses, in which icosahedra and icosahedra/face-centered cubic (fcc)-defect structures are predominant.

Vertically aligned nanowire arrays of copper indium diselenide (CuInSe2 or CIS) of controllable diameter and length were fabricated by simultaneously electrodepositing Cu, In, and Se from an acid bath into the pores of anodized aluminum oxide (AAO) formed on top of an aluminum sheet. X-ray diffraction measurements revealed a preferential [112] orientation and the energy dispersive x-ray analysis (EDX) measurements indicated an overall composition close to stoichiometric CuInSe2. Ohmic contact to CIS was formed by depositing a 100 nm thick of gold layer on top, and thus a Schottky diode device of the Au/CIS nanowires/Al configuration was obtained. Analysis of the current–voltage characteristics of these devices yielded diode ideality factor and reverse saturate current density values slightly higher than those reported in the literature for bulk CIS/Al junctions. Capacitance–voltage measurements were performed on the diodes to get the estimates of space charge density and the junction potential.

We report the characteristics of epitaxial growth and properties of vanadium oxide (VO2) thin films on sapphire (0001) substrates. Pulsed laser deposition was used to grow (002) oriented VO2 films on sapphire (0001). Transmission electron microscopy studies showed that the orientation relationship between the substrate and the thin film is: (002)f2∥(0006)sub3 and [010]f2 ∥sub. It was also established that VO2 has three different orientations in the film plane which are rotated by 60° from each other. The epitaxial growth of vanadium oxide on sapphire (0001) has been explained in the framework of domain matching epitaxy (DME). Electrical resistivity measurements as a function of temperature showed a sharp transition with a hysteresis width ˜5 °C, and large resistance change (˜1.5 × 104) from the semiconductor phase to the metal phase. It is interesting to note that in spite of large angle twin boundaries in these VO2 films, the SMT characteristics are better than those observed for polycrystalline films. The higher width of thermal hysteresis for the VO2 film on c-sapphire compared to a bulk single VO2 crystal and a single-crystal VO2 film on r-sapphire can be attributed to the existence of these large-angle twin grain boundaries. These findings can provide insight into the phase transformation characteristics of VO2, which has important applications in switching and memory devices.

Quasi-static and dynamic deformation behaviors of Zr-based bulk-metallic-glass-matrix composites, fabricated by Bridgman solidification, were investigated in this study. Upon quasi-static compressive loading, the composites exhibit ultrahigh strength, accompanied by considerable plasticity. The multiplication of shear bands on the lateral surface of deformed samples, and the highly-dense liquid drops on the fracture surface, are in agreement with the improved plasticity. However, upon dynamic loading, the mechanical properties of the composites deteriorate considerably, due to insufficient time to form profuse shear bands. The strain-rate responses of the mechanical properties of the crystalline alloys and the in situ and ex situ bulk metallic glass composites are compared, and the different deformation mechanisms of the in situ composites upon quasi-static and dynamic loading are explained.

Glancing-incidence x-ray diffraction (GIXRD) has been applied to the investigation of depth-dependent stress distributions within electroplated Cu films due to overlying capping layers. Cu films, 0.65 μm thick, plated on conventional barrier and seed layers received a chemical vapor deposited (CVD) SiCxNyHz cap, an electrolessly deposited CoWP layer, or a CoWP layer followed by a SiCxNyHz cap. GIXRD and conventional x-ray diffraction measurements revealed that strain gradients were created in Cu films possessing a SiCxNyHz cap, where a greater in-plane tensile stress of approximately 180 MPa was generated near the film/cap interface as a result of constraint imposed by the SiCxNyHz layer during cooling from the cap deposition temperature. Although Cu films possessing a CoWP cap without a SiCxNyHz layer did not exhibit depth-dependent stress distributions, subsequent annealing introduced stress gradients and increased the bulk Cu stress. However, a thermal excursion to liquid-nitrogen temperatures significantly reduced tensile stresses in the Cu films.

In our previous paper, the expanding cavity model (ECM) and Lamé solution were used to obtain an analytical expression for the scale ratio between hardness (H) to reduced modulus (Er) and unloading work (Wu) to total work (Wt) of indentation for elastic-perfectly plastic materials. In this paper, the more general work-hardening (linear and power-law) materials are studied. Our previous conclusions that this ratio depends mainly on the conical angle of indenter, holds not only for elastic perfectly-plastic materials, but also for work-hardening materials. These results were also verified by numerical simulations.

BaCo1/3Nb2/3O3 ceramics, with a high density and a similar, high degree of 1:2 B-site cation ordering, exhibit very different quality factors, Q. The ceramics exhibit p-type behavior with higher conductivity and lower Q for samples processed in O2 as compared with those processed in air. It is proposed that unavoidable Co loss during high-temperature ceramic processing leads to p-type doping that must be compensated by oxygen vacancies to impede hole formation. The composition exhibiting only intrinsic conduction and optimized Q is not achieved with processing in atmospheric oxygen due to filling of oxygen vacancies and hole formation during cooling.

The influence of temperature on the indentation size effect is explored experimentally. Copper is indented on a custom-built high-temperature nanoindenter at temperatures between ambient and 200 °C, in an inert atmosphere that precludes oxidation. Over this range of temperatures, the size effect is reduced considerably, suggesting that thermal activation plays a major role in determining the length scale for plasticity.