12 results
CMP Challenges for Advanced Technology Nodes
-
- Journal:
- MRS Advances / Volume 2 / Issue 44 / 2017
- Published online by Cambridge University Press:
- 16 May 2017, pp. 2361-2372
- Print publication:
- 2017
-
- Article
- Export citation
Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1560 / 2013
- Published online by Cambridge University Press:
- 21 August 2013, mrss13-1560-bb01-04
- Print publication:
- 2013
-
- Article
- Export citation
Cu CMP and its Challenge for 20nm Nodes and Beyond
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1428 / 2012
- Published online by Cambridge University Press:
- 30 July 2012, mrss12-1428-c06-03
- Print publication:
- 2012
-
- Article
- Export citation
Planarization Specification for 22nm and Beyond BEOL CMP
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-E01-04
- Print publication:
- 2010
-
- Article
- Export citation
Cu CMP Edge Uniformity Improvement Studies for 32 nm Technology Node and Beyond
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-E01-06
- Print publication:
- 2010
-
- Article
- Export citation
From Process Assumptions to Development to Manufacturing
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1079 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1079-N02-01
- Print publication:
- 2008
-
- Article
- Export citation
Evaluation of the Chemical-mechanical Planarization (CMP) Performance of Silicon Nitride and Silicon Carbide as Hard Mask Materials for Cu-based Interconnect Technology
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 732 / 2002
- Published online by Cambridge University Press:
- 01 February 2011, I1.7
- Print publication:
- 2002
-
- Article
- Export citation
The Intercorrelation Between Microstructure and Chemicalmechanical Polish of Metal Thin Films
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 564 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 459
- Print publication:
- 1999
-
- Article
- Export citation
On the Pattern Dependency and Substrate Effects During Chemical-Mechanical Planarization for Ulsi Manufacturing
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 566 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 217
- Print publication:
- 1999
-
- Article
- Export citation
Thermal Stresses, Interfacial Reactions and Microstructures of Al/Ti and Al/TiN Thin Films Encapsulated by SiOF
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 476 / 1997
- Published online by Cambridge University Press:
- 15 February 2011, 267
- Print publication:
- 1997
-
- Article
- Export citation
Surface Characteristics, Etching Behaviors and Chemicalmechanical Polishing of Aluminum Alloy thin Films
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 477 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 125
- Print publication:
- 1997
-
- Article
- Export citation
Material Characterization and Chemical-Mechanical Polishing of Low-Dielectric Constant Fluorinated Silicon Dioxide Films
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 441
- Print publication:
- 1996
-
- Article
- Export citation