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Cu CMP Edge Uniformity Improvement Studies for 32 nm Technology Node and Beyond

  • John H Zhang (a1), Laertis Economikos (a2), Wei-tsu Tseng (a3), Jihong Choi (a4), Qiang Fang (a5), Teck Jung Tang (a6), Joe Salfelder (a7) and Connie Truong (a8)...

Abstract

Studies of the wafer edge uniformity step by step, from hard mask deposition, reactive ion etch, electroplating to post Cu CMP had been done using scanning electron microscopy (SEM) measurements, showed that the major wafer non-uniformity comes from the Cu CMP step. Improvement of Cu CMP edge uniformity had been achieved through engineering of platen 1 using real time profile control as well as CMP head zone pressure adjustment and platen 3 slurry optimizations

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1 Tseng, W-T, Kioussis, D., Manikonda, S., Kim, H-K, Choi, J., Zhao, F., Economikos, L., Klymko, N., Chace, M., Molis, S., Chae, M., Engbrecht, E., Zielinski, E., Truong, C., and Watts, D. , ECS Transaction, 13, 2, 293-306 (2008).
2 Ong, P., Economikos, L., Hong, D.H., Chae, M., Quon, R., Grunow, S., Dipaola, D., Siddiqi, S., Liegl, B., Ponoth, S., Tseng, W-T, Ticknor, A., Fang, R., Kulkarni, D., Lagus, M., Matusiewicz, G., Angyal, M., and Watts, D., Proc. of International Conference on Planarization/CMP Technology ICPT, Foster City, California, Oct.12-14, 2006
3 Zantye, P. B., Kumar, A., and Sikder, A.K., “Chemical mechanical planarization for microelectronics applications”, Mater. Sci. Eng. R., 45, 89220 (2004)
4 Canaperi, D. F., Kawaguchi, T., Loquet, Y., Tsumura, K., Isobayashi, A., Smalley, M.. Proc. of MRS Spring, San Francisco, California, Apr. 5-9, 2010
5 Choi, J., Tseng, W-T, Kim, H.K., Economikos, L., Fang, Q., Zielinskil, E., Engbrecht, E., Child, C., Chae, M., and Moon, Y., Proc. of Advanced Metallization Conference p449455, San Diego, California, Sept. 23-25, 2008
6 Zhang, J.H, Venigalla, R., Stoll, D. C., Wallner, J., Thompson, J. F., Sun, J., Zhuang, H., Xiao, C., Koo, J.E., Park, J.E., Kleemier, W., Barla, K., Truong, C., Chen, X., and Sampson, Ron, Proc. VMIC, 25, 95 (2008)

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Cu CMP Edge Uniformity Improvement Studies for 32 nm Technology Node and Beyond

  • John H Zhang (a1), Laertis Economikos (a2), Wei-tsu Tseng (a3), Jihong Choi (a4), Qiang Fang (a5), Teck Jung Tang (a6), Joe Salfelder (a7) and Connie Truong (a8)...

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