Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics
Research Article
Isothermal Fatigue of 62Sn–36Pb–2Ag Solder
- Published online by Cambridge University Press: 26 February 2011, 3
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Presence of Anelastic Strains in High Lead Solders at Ambient and High Temperatures
- Published online by Cambridge University Press: 26 February 2011, 15
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A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling
- Published online by Cambridge University Press: 26 February 2011, 23
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Continuous Wetiability Measurement for Solder Reflow
- Published online by Cambridge University Press: 26 February 2011, 29
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Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process
- Published online by Cambridge University Press: 26 February 2011, 37
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A Comparison of the Metallurgical Behavior of Gold and Copper Wires in Ball Bonding
- Published online by Cambridge University Press: 26 February 2011, 43
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Numerical Analysis of the Bali. Forming Process in Copper Ball Bonding
- Published online by Cambridge University Press: 26 February 2011, 49
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Mechanical Behavior of Encapsulants in Microelectronic Packaging
- Published online by Cambridge University Press: 26 February 2011, 57
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Thermal Modeling of Plastic Ic Packages
- Published online by Cambridge University Press: 26 February 2011, 67
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Elastomeric Conductors for Electrical Contacts
- Published online by Cambridge University Press: 26 February 2011, 85
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Mechanical Modeling of Stress Generation During Cure of Encapsulating Resins 1
- Published online by Cambridge University Press: 26 February 2011, 91
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A Methodology for Reliability Assessment of Non-Ductile Encapsulants
- Published online by Cambridge University Press: 26 February 2011, 97
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Mechanical Characterization of Photoresist Polymer Coatings as a Function of Processing History
- Published online by Cambridge University Press: 26 February 2011, 109
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The Interplay of Thermo-Mechanical Properties in the Growth and Processing of III-V Materials
- Published online by Cambridge University Press: 26 February 2011, 117
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The Effects of Stress on the Interdiffusion in Si1-xGex/Si Superlattices
- Published online by Cambridge University Press: 26 February 2011, 129
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Experimental Evaluation of Mechanical Behavior of GaAs Wafer Material
- Published online by Cambridge University Press: 26 February 2011, 141
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Crystal Plasticity Analysis of Thermal Deformation and Dislocation Accumulation in Gaas/Si Patterned Structure
- Published online by Cambridge University Press: 26 February 2011, 147
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Silicon Carbide Whisker Reinforced Aluminum with Improved Temperature Resistance Due to the Use of a Phosphate Binder
- Published online by Cambridge University Press: 26 February 2011, 153
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Stress Dependent Electrical Activation of Implanted Si IN GaAs - A Four Point Bending Study
- Published online by Cambridge University Press: 26 February 2011, 157
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The AC-Indentation Technique and its Application to Al and Al-Si Coatings
- Published online by Cambridge University Press: 26 February 2011, 165
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