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Numerical Analysis of the Bali. Forming Process in Copper Ball Bonding

Published online by Cambridge University Press:  26 February 2011

Fang Iiongyuan ,
Oian Yiyu  and
Jiang Yihong
Fang Iiongyuan
Affiliation:
Doctor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's, Republic of China
Oian Yiyu
Affiliation:
Professor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's, Republic of China
Jiang Yihong
Affiliation:
Professor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's, Republic of China
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Abstract

In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical analysis. By means of calculation of temperature field, speed field and displacement field for ultrafine copper wire under a miniarc, the regular pattern of copper wire ball formation has been clarified. In this paper, the calculating result of displacement field has also been tested and verified.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 49
Copyright
Copyright © Materials Research Society 1991

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